Product details

CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) -40 to 140 Ethernet MAC only
CPU Arm Cortex-R5F Frequency (MHz) 400 Protocols GPIO, I2C, JTAG, SPI, UART Hardware accelerators C66x Core, HWA 2.0 Accelerator Features 2x CSI-2, C66x DSP Operating system FreeRTOS Security Cryptographic acceleration, Hardware-enforced isolation, Secure boot, Secure debug, Secure storage Rating Automotive Operating temperature range (°C) -40 to 140 Ethernet MAC only
NFBGA (NZN) 225 169 mm² 13 x 13 NFBGA (ZCE) 285 169 mm² 13 x 13

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

Processor Cores:

  • Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

    • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
    • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
    • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
    • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
  • C66x DSP core
    • Single core, 32-bit, floating point DSP
    • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

  • Up to 5.0MB On Chip RAM (OCSRAM)
    • Memory space sharable between DSP, MCU, and shared L3
    • 3.5625MB shared L3 memory
    • 960KB dedicated to Main subsystem
    • 384KB dedicated to DSP subsystem
  • External Memory Interfaces (EMIF)
    • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

  • 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
  • 5x Real-Time Interrupt (RTI) modules
  • Mailbox system for Interprocessor Communication (IPC)
  • JTAG/Trace interfaces for device debugging
  • Clock source
    • 40.0MHz crystal with internal oscillator
    • Supports external oscillator at 40/50MHz
    • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

  • 10/100Mbps Ethernet (RGMII/RMII/MII)
  • Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
  • Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

  • General Purpose Analog to Digital Converters (GPADC)
    • 1x 9-channel ADC supporting up to 625Ksps
  • Digital Connectivity
    • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
    • 3x Inter-Integrated Circuit (I2C) ports
    • 4x Universal Asynchronous Receiver-Transmitters (UART)
    • 3x Multi-channel Audio Serail Port (McASP)
    • Audio Tracking Logic (ATL)

Industrial and control interfaces:

  • 3x Enhanced Pulse-Width Modulator (ePWM)
  • 1x Enhanced Capture Module (eCAP)
  • 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

  • Recommend LP87745-Q1 Power Management ICs (PMIC)
  • Simplified power sequencing and reduced number of power supply rails
  • Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

  • Device Security
    • Programmable embedded Hardware Security Module (HSM)
    • Secure authenticated and encrypted boot support
    • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
    • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

  • Functional Safety Quality Managed
    • Documentation will be available to aid ISO 26262 functional safety system design
  • AEC-Q100 Qualified
  • Operating Conditions
    • Extended automotive grade temperature range supported
    • Extended industrial grade temperature range supported

Package options:

  • ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
  • NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

The AM273x family of microcontrollers are highly-integrated, high-performance microcontrollers based on the Arm Cortex-R5F and a C66x floating-point DSP cores. The device enables original equipment manufacturers (OEM) and original design manufacturers (ODM) to quickly bring to market devices with robust software support, rich user interfaces, and high performance. The device offers the maximum flexibility of a fully integrated, mixed processor design.

With an integrated Hardware Security Module (HSM), functional safety support built in, large, integrated RAM on die, and a wide temperature range, the AM273x offers a safe, secure and cost effective design for many industrial and automotive applications.

The AM273x device is provided as part of a complete platform including hardware reference designs, software drivers, DSP library, sample software configurations/applications, API guide, and user documentation.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet AM273x Sitara™ Microcontrollers datasheet (Rev. C) PDF | HTML 06 Jun 2025
* Errata AM273x Sitara Microcontrollers Silicon Revision 1.0 (Rev. C) PDF | HTML 14 May 2025
* User guide AM273x Technical Reference Manual (Rev. E) 10 Apr 2025
Application brief AM273x QSPI Flash Selection Guide (Rev. A) PDF | HTML 07 Apr 2025
Application note Microcontroller Abstraction Layer on Jacinto™ and Sitara™ Embedded Processors PDF | HTML 28 Jan 2025
Functional safety information AM273x AUTOSAR MCAL Drivers Functional Safety Certificate 20 Aug 2024
Application note AM273x Hardware Design Guide (Rev. A) PDF | HTML 27 Nov 2023
Product overview Functional Safety for AM2x and Hercules™ Microcontrollers PDF | HTML 08 Nov 2023
Application note Sitara MCU Thermal Design PDF | HTML 11 Sep 2023
Application note Integration of MbedTLS on SITARA MCU Devices PDF | HTML 03 Aug 2023
User guide 10-kW, Three-Phase, Three-Level (T-Type) Inverter Using AM263 PDF | HTML 11 Jul 2023
Application note Debugging Sitara AM2x Microcontrollers PDF | HTML 24 Oct 2022
Application note Optimized Trigonometric Functions on TI Arm Cores (Rev. A) PDF | HTML 08 Aug 2022
Application note Power Estimation Tool PDF | HTML 01 Dec 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

AWR2243BOOST — AWR2243 second-generation 76-GHz to 81-GHz high-performance automotive MMIC evaluation module

The AWR2243 BoosterPack™ plug-in module is an easy-to-use evaluation board for the single-chip AWR2243 mmWave sensing device.

AWR2243BOOST contains everything required to start developing using the MMWAVE-STUDIO environment and the DCA1000 real-time data capture adapter.

The standard 20-pin (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

DCA1000EVM — DCA1000 evaluation module for real-time data capture and streaming

The DCA1000 evaluation module (EVM) provides real-time data capture and streaming for two- and four-lane low-voltage differential signaling (LVDS) traffic from TI AWR and IWR radar sensor EVMs. The data can be streamed out via 1-Gbps Ethernet in real time to a PC running the MMWAVE-STUDIO tool for (...)

User guide: PDF
Not available on TI.com
Debug probe

TMDSEMU110-U — XDS110 JTAG Debug Probe

The Texas Instruments XDS110 is a new class of debug probe (emulator) for TI embedded processors. The XDS110 replaces the XDS100 family while supporting a wider variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. Also, all XDS debug probes support Core and System Trace in all (...)

User guide: PDF
Not available on TI.com
Debug probe

TMDSEMU560V2STM-U — XDS560™ software v2 system trace USB debug probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Debug probe

TMDSEMUPROTRACE — XDS560v2 PRO TRACE Receiver & Debug Probe

Important: The XDS560v2 PRO TRACE Receiver is a legacy product that supports pin trace for TI processors. For new devices it is recommended to use a third party trace receiver.

The XDS560v2 PRO TRACE Receiver supports the same features as the XDS560v2 System Trace family (USB version, USB & (...)

Not available on TI.com
Debug probe

LB-3P-TRACE32-ARM — Lauterbach TRACE32® Debug and Trace System for Arm®-based Microcontrollers and Processors

Lauterbach‘s TRACE32® tools are a suite of leading-edge hardware and software components that enables developers to analyze, optimize and certify all kinds of Arm®-based microcontrollers and processors. The globally renowned debug and trace solutions for embedded systems and SoCs are the perfect (...)

Debug probe

TSK-3P-BLUEBOX — TASKING BlueBox hardware debugger

TASKING’s Debug, Trace, and Test tools offer comprehensive solutions for efficient debugging, tracing, and testing of TI's embedded systems. The scalable TASKING BlueBox debuggers allow users to easily flash, debug, and test across TI's portfolio. Development on TI hardware is made even easier with (...)

Third-party accessory

VCTR-3P-VX1000 — VX1000 Measurement and Calibration Interface Hardware

The VX1000 hardware enables measurement and calibration tools such as CANape to access ECUs with high performance and marginal impact on runtime. It is designed for use in vehicles but can also be used on test benches and in the laboratory. Thanks to its high scalability and broad portfolio, the (...)

Software development kit (SDK)

EP-DSP-TPR12-SECURITY Preliminary software & documents for early engagement customers

The MCU+ SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demos.  This software accelerates application development schedules by eliminating the need to create basic system (...)

Supported products & hardware

Supported products & hardware

Software development kit (SDK)

MCU-PLUS-SDK-AM273X MCU+ SDK for AM273x – RTOS, No-RTOS

The MCU+ SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to examples, benchmarks and demos.  This software accelerates application development schedules by eliminating the need to create basic system (...)

Supported products & hardware

Supported products & hardware

Browse Download options
Software development kit (SDK)

MMWAVE-MCUPLUS-SDK mmWave SDK for AWR2544, AWR2944,AWR2944LC and AM2732

The mmWave microcontroller (MCU) plus software development kit (SDK) is a collection of software packages that enable application evaluation and development on TI mmWave sensors. This tool includes the MMWAVE-MCUPLUS-SDK and companion packages to support your design needs.

MMWAVE-MCUPLUS-SDK is a (...)

Supported products & hardware

Supported products & hardware

Download options
Software development kit (SDK)

MMWAVE-SDK mmWave software development kit (SDK)

The mmWave software development kit (SDK) is a collection of software packages to enable application evaluation and development on TI mmWave sensors. This tool includes the MMWAVE-SDK and companion packages to support your design needs.

The MMWAVE-SDK is a unified software platform for the TI (...)

Supported products & hardware

Supported products & hardware

Launch Download options
Getting started

TI-DEVELOPER-ZONE Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
Supported products & hardware

Supported products & hardware

IDE, configuration, compiler or debugger

CCSTUDIO Code Composer Studio™ integrated development environment (IDE)

Code Composer Studio is an integrated development environment (IDE) for TI's microcontrollers and processors. It is comprised of a rich suite of tools used to build, debug, analyze and optimize embedded applications. Code Composer Studio is available across Windows®, Linux® and macOS® platforms.

(...)

Supported products & hardware

Supported products & hardware

Launch Download options
Online training

AM27X-ACADEMY AM27x Academy

AM27x Academy features easy-to-use training modules ranging from the basics of getting started to advanced development topics.
Supported products & hardware

Supported products & hardware

Operating system (OS)

GHS-3P-UVELOSITY — Green Hills Software u-velOSity Safety RTOS

The µ-velOSity™ Safety RTOS is the smallest of Green Hills Software's real-time operating systems and was designed especially for microcontrollers. It supports a wide range of TI processor families using the Arm® Cortex-M or Cortex-R cores as a main CPU or as a co-processors (...)
Software programming tool

UNIFLASH CCStudio UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

Supported products & hardware

Supported products & hardware

Launch Download options
Support software

VCTR-3P-MICROSAR — Vector MICROSAR AUTOSAR software for microcontrollers and high-performance computers (HPCs)

MICROSAR and DaVinci product families simplify ECU development with sophisticated embedded software and powerful development tools for both microcontrollers and HPCs. With advanced infrastructure software, you create an optimal basis for your ECUs and simplify all accompanying development tasks (...)
Simulation model

AM273x 0.8-mm Package Sitara BSDL Model

SPRM813.ZIP (4 KB) - BSDL Model
Simulation model

AM273x 0.8-mm Package Sitara Thermal Model

SPRM814.ZIP (6 KB) - Thermal Model
Simulation model

AM273x BSDL Model

SPRM790.ZIP (3 KB) - BSDL Model
Simulation model

AM273x IBIS Model

SPRM789.ZIP (2167 KB) - IBIS Model
Simulation model

AM273x IBIS Model 0.80 mm package

SPRM812.ZIP (1862 KB) - IBIS Model
Simulation model

AM273x Thermal Model

SPRM788.ZIP (31 KB) - Thermal Model
Calculation tool

SPRM803 AM273x Power Estimation Tool

Supported products & hardware

Supported products & hardware

Reference designs

TIDA-020047 — Two-device mmWave cascade reference design for automotive 4D imaging radar

This automotive radar reference design is a cascaded 76-GHz to 81-GHz radar sensor module. This includesa two-device cascaded array of AWR2243 devices and an AM2732R radar processor. In this cascaded radar configuration, a primary device distributes a 20-GHz local-oscillator (LO) signal to both (...)
Design guide: PDF
Package Pins CAD symbols, footprints & 3D models
NFBGA (NZN) 225 Ultra Librarian
NFBGA (ZCE) 285 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

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