Die & wafer services

Reduce design size and weight with our tested die, bare die and wafer offerings

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Texas Instruments offers bare die and wafer services that enable size and weight reduction, enhanced function integration, and reduced system design cost. A variety of testing and qualification options are available based on product maturity and complexity, as well as customer requirements. We also offer space-grade products as Known Good Die (KGD) certified to MIL-PRF-38535 with Radiation Lot Acceptance Test (RLAT) for manufacturers of space-grade modules. Additional die and wafer products not currently on TI.com are available through Micross.

New products

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UCC27624V
NEW
Die & wafer services
UCC27624V ACTIVE

5A/5A dual-channel gate driver with 8V UVLO, 30V VDD and low propagation delay

Approx. price (USD) 1ku | 0.35

UCC27624V-Q1
NEW
Die & wafer services
UCC27624V-Q1 ACTIVE

Automotive 5A/5A dual-channel gate driver with 8V UVLO, 30V VDD and low propagation delay

Approx. price (USD) 1ku | 0.413

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Our bare die & wafer offerings

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Tested die

Small volume waffle pack quantities for quick prototyping. Tested die are 25°C DC probed with no special testing.

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Known good die

Die tested to the same quality and reliability standards as their packaged equivalents.

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Wafer sales

TI offers commercial wafers through authorized distributors.

Die distribution and value-added services

Authorized distributor

Micross Components is a leading global provider of specialty electronics solutions for defense, space, medical and demanding industrial industries.

As a single-source supplier of advanced high-reliability electronics, they manufacture and distribute a wide range of products, including integrated circuit and discrete bare die and wafers. Additional die and wafer products not currently on TI.com are available through Micross. 

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Technical resources

Application note
Application note
Die & Wafer Overview
Get an introduction to our die product offerings including the advantages of die products and how we categorize our die product offerings.
document-pdfAcrobat PDF
White paper
White paper
Die Assembly Techniques White Paper
A wide variety of die assembly methods and materials are available for implementation into high yield, high reliability systems. Some of the options for COB die attach are reviewed here for comparison.
document-pdfAcrobat PDF
Resource
Resource
Terms of sale for die & wafer products
Review the TI terms of sale (TOS) for our products, including our die and wafer products.