Begin developing and testing CC2340R5 with TI's Launchpad environment
See required software and hardware to start developing your application code for CC2340R5.
Select a platform
Development kit
LP-EM-CC2340R5 — CC2340R5 LaunchPad™ development kit for SimpleLink™ Bluetooth® 5.3 Low Energy MCU
Not available on TI.com
Evaluation board
LP-XDS110ET — XDS110ET LaunchPad™ development kit debugger with EnergyTrace™ software
Not available on TI.com
IDE, configuration, compiler or debugger
ENERGYTRACE — MSP EnergyTrace technology (delivered in Code Composer Studio™ IDE)
Need to analyze application energy profile for power optimization.
Development kit
LP-XDS110 — XDS110 LaunchPad™ development kit debugger
Not available on TI.com
Online training
SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy
SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy
Version: 1.00.00.00
Release date: 03 Apr 2023
Products
Low-power 2.4-GHz products
Automotive wireless connectivity products
Hardware development
Evaluation board
Release Infomation
Initial release of CC23xx academy
IDE, configuration, compiler or debugger
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)
Version: 20.2.0
Release date: 02 Jun 2025
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This design resource supports most products in these categories.
Check the product details page to verify support.
-
parametric-filter Digital signal processors (DSPs) -
parametric-filter Arm-based processors -
parametric-filter MSP430 microcontrollers -
parametric-filter C2000 real-time microcontrollers -
parametric-filter Arm-based microcontrollers -
parametric-filter Signal conditioners -
parametric-filter mmWave radar sensors -
parametric-filter Wi-Fi products -
parametric-filter Sub-1 GHz products -
parametric-filter Digital power isolated controllers
Products
Arm Cortex-M0+ MCUs
Arm Cortex-M4 MCUs
Arm Cortex-R MCUs
Automotive mmWave radar sensors
Industrial mmWave radar sensors
Sub-1 GHz wireless MCUs
Hardware development
Evaluation board
Development kit
Documentation
Release Infomation
The Code Composer Studio™ IDE is a complete integrated suite that enables developers to create and debug applications of all Texas Instruments Embedded Processors (Sitara, DSP, Automotive, Keystone), Microcontrollers (SimpleLink™, C2000 Digital Control, MSP430, TM4C, Hercules), as well as Digital Power (UCD) and Programmable Gain Amplifier (PGA) devices.
CCS v20 is TI’s next generation Integrated Development Environment (IDE) based on Theia IDE framework. CCS v20.2.0 uses a modified version of the Theia-IDE framework and offers a user experience similar to Visual Studio Code™.
- Installation instructions and User's Guide
- Windows 32bit is not supported with CCSv20.
- XDS510 class debug probes are not supported with CCSv20.
What's new
- Theia IDE core update (v1.58); AI features available via Theia AI, or third party extensions; added new 'AI/Code Assistants' link in Getting Started page
- Associated AppNote: https://software-dl.ti.com/ccs/esd/documents/application_notes/appnote-ccs_ai_code_assistant.html
- Various IDE/Project/Debug improvements
- Support installing CCS into Program Files folder on Windows
- SysConfig v1.24
- Segger J-Link support v8.34.0
- Compiler updates (TI Arm Clang v4.0.3.LTS, C2000 v22.6.2.LTS, C7000 v5.0.0.LTS)
- Device Support updates (AM26D, AM261x, AM263Px, CC27xx, F28E12, F29H85x, MSPM0G5x etc.)
- Please see the Release Notes for full list of changes: https://software-dl.ti.com/ccs/esd/CCSv20/CCS_20_2_0/exports/CCS_20.2.0_ReleaseNote.htm
Software development kit (SDK)
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices
Version: 9.10.00.83
Release date: 08 May 2025
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Products
Low-power 2.4-GHz products
Automotive wireless connectivity products
Hardware development
Evaluation board
Documentation
Release Infomation
The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:
- Bluetooth® Low Energy (BLE) protocol stack
- Zigbee® protocol stack supporting low power wireless mesh networks
- Proprietary RF layer
- TI Drivers
All of the above are provided in one easy-to-use software package along with example applications and documentation.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.
This is version 9.10.00.83 of the SimpleLink Low Power F3 SDK.
Supported Features and Limitations
CC23xx
CC27xx
LAES & HSM Limitations
The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.
For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle or will return a NULL handle (AESGCM, ECC, RNG Drivers). If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.
For drivers that support running operations on both hardware accelerators, for primarily AES drivers, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding of each key, part of the input parameters to drivers’ APIs, holes the value of the engine-of-choice.
- To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ or ‘KeyStore_PSA_initKeyHSM(..)’ API and pass in the plaintext key as well as the key length.
- To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.
NOTE:
- Please refer to each driver’s top level header file for driver-specific limitations.
- Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.
- Starting SDK version 9.10, the crypto drivers are removed from the drivers library and moved into a separate secure drivers library: source/ti/drivers/secure/lib.
- Starting SDK version 9.10, if SysConfig generated libraries linker is not used, the secure drivers library will need to be added manually into the respective linker settings.
What's new
- Bluetooth LE Channel Sounding preview.
- Bluetooth LE Connection Monitor with BLE Stack integration for CC23xx and CC27xx devices.
- Bluetooth LE Power Control Preview for CC23XX and CC27xx devices.
- Bluetooth LE Connection Handover with GATT Layer.
- Certification of devices to be compliant with China MIIT (Ministry of Industry and Information Technology) and the EU RED (European Union Radio Equipment Directive) regulations on 2.4GHz.
- Zigbee Stack Certification - Zigbee Pro 2023 (R23) and Green Power Proxy v1.1.2 (Zigbee Core v1.0.0.0)