Select a version

Select a version

No results found. Please clear your search and try again.

SIMPLELINK-LOWPOWER-F3-SDK

SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

Select a version
No results found. Please clear your search and try again.
Latest version
Version: 9.10.00.83
Release date: May 8, 2025
Products
Automotive wireless connectivity products
CC2340R5-Q1 Automotive-qualified SimpleLink™ Bluetooth® Low Energy wireless MCU with 512-kB flash CC2745P10-Q1 Automotive SimpleLink™ Bluetooth® 6.0 LE wireless MCU with 1MB flash, HSM, APU, CAN-FD, +20dBm CC2745R10-Q1 Automotive SimpleLink™ Bluetooth® 6.0 LE wireless MCU with 1MB flash, HSM, APU, CAN-FD
Low-power 2.4-GHz products
CC2340R2 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 256kB flash CC2340R5 SimpleLink™ 32bit Arm® Cortex®-M0+ 2.4GHz wireless MCU with 512kB flash CC2755R10 SimpleLink™ 32-bit Arm® Cortex®-M33 Bluetooth® Low Energy wireless MCU with 1MB flash
Hardware development
Evaluation board
LP-EM-CC2340R5 CC2340R5 LaunchPad™ development kit for SimpleLink™ Bluetooth® 5.3 Low Energy MCU LP-EM-CC2340R53 LaunchPad™ development kit for CC2340R SimpleLink™ family of 2.4GHz multi-standard wireless MCUs LP-EM-CC2745R10-Q1 CC2745R10-Q1 LaunchPad™ development kit for SimpleLink™ 2.4GHz wireless MCU

Release Information

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:

  • Bluetooth® Low Energy (BLE) protocol stack

  • Zigbee® protocol stack supporting low power wireless mesh networks

  • Proprietary RF layer

  • TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 9.10.00.83 of the SimpleLink Low Power F3 SDK.

Supported Features and Limitations

CC23xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported AES-ECB Supported AESECB_oneStepDecrypt, AESECB_setupDecrypt not supported AES-GCM Supported AES-CTR Supported AES-CBC Supported AESCBC_oneStepDecrypt, AESCBC_setupDecrypt not supported AES-CTR-DRBG Supported AES-CMAC Supported SHA-256 Supported ECDH Supported ECIES Supported RNG Supported TRNG Not Supported

CC27xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported HSM AES-ECB Supported HSM AES-GCM Supported HSM AES-CTR Supported HSM AES-CBC Supported HSM AES-CTR-DRBG Not Supported This is supported via RNG AES-CMAC Supported HSM ECDH Supported HSM ECDSA Supported HSM RNG Supported HSM (AES-CTR-DRBG) TRNG Supported HSM

LAES & HSM Limitations

The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.

For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle or will return a NULL handle (AESGCM, ECC, RNG Drivers). If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.

For drivers that support running operations on both hardware accelerators, for primarily AES drivers, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding of each key, part of the input parameters to drivers’ APIs, holes the value of the engine-of-choice.

  • To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ or ‘KeyStore_PSA_initKeyHSM(..)’ API and pass in the plaintext key as well as the key length.

  • To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.

NOTE:

  • Please refer to each driver’s top level header file for driver-specific limitations.

  • Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.

  • Starting SDK version 9.10, the crypto drivers are removed from the drivers library and moved into a separate secure drivers library: source/ti/drivers/secure/lib.

  • Starting SDK version 9.10, if SysConfig generated libraries linker is not used, the secure drivers library will need to be added manually into the respective linker settings.

What's new

  • Bluetooth LE Channel Sounding preview.

  • Bluetooth LE Connection Monitor with BLE Stack integration for CC23xx and CC27xx devices.

  • Bluetooth LE Power Control Preview for CC23XX and CC27xx devices.

  • Bluetooth LE Connection Handover with GATT Layer.

  • Certification of devices to be compliant with China MIIT (Ministry of Industry and Information Technology) and the EU RED (European Union Radio Equipment Directive) regulations on 2.4GHz.

  • Zigbee Stack Certification - Zigbee Pro 2023 (R23) and Green Power Proxy v1.1.2 (Zigbee Core v1.0.0.0)