DRA788
- Architecture designed for infotainment applications
- Up to 2 C66x floating-point VLIW DSP
- Fully object-code compatible with C67x and C64x+
- Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
- Up to 512kB of on-chip L3 RAM
- Level 3 (L3) and Level 4 (L4) interconnects
- Memory Interface (EMIF) module
- Supports DDR3/DDR3L up to DDR-1066
- Supports DDR2 up to DDR-800
- Up to 2GB supported
- Dual Arm® Cortex®-M4 (IPU)
- Vision accelerationPac
- Embedded Vision Engine (EVE)
- Display subsystem
- Display controller with DMA engine
- CVIDEO / SD-DAC TV analog composite output
- On-chip temperature sensor that is capable of generating temperature alerts
- General-Purpose Memory Controller (GPMC)
- Enhanced Direct Memory Access (EDMA) controller
- 3-port (2 external) Gigabit Ethernet (GMAC) switch
- Controller Area Network (DCAN) module
- CAN 2.0B protocol
- Modular Controller Area Network (MCAN) module
- CAN 2.0B protocol
- Eight 32-bit general-purpose timers
- Three configurable UART modules
- Four Multichannel Serial Peripheral Interfaces (McSPI)
- Quad SPI interface
- Two Inter-Integrated Circuit (I2C™) ports
- Three Multichannel Audio Serial Port (McASP) modules
- Secure Digital Input Output Interface (SDIO)
- Up to 126 General-Purpose I/O (GPIO) pins
- Power, reset, and clock management
- On-chip debug with CTools technology
- Automotive AEC-Q100 qualified
- 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
- Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
- 8-channel 10-bit ADC
- PWMSS
- Video and image processing support
- Full-HD video (1920 × 1080p, 60 fps)
- Video input and video output
- GPIOs when not used for video
- Video Input Port (VIP) module
- Support for up to 4 multiplexed input ports
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.
Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.
The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.
Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.
The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.
The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.
设计和开发
电源解决方案
查找适用于 DRA788 的电源解决方案。TI 提供适用于 TI 和非 TI 片上系统 (SoC)、处理器、微控制器、传感器和现场可编程门阵列 (FPGA) 的电源解决方案。
DRA78XEVM — DRA78x 评估模块
Jacinto™ DRA78x 评估模块 (EVM) 是一款评估平台,旨在加速无线电信号处理器 (RSP) 应用的开发工作和上市进程。该 EVM 基于采用异构可扩展架构的 Jacinto DRA78x SoC 而构建,该架构包含以下组合:
- TI 的定点和浮点 TMS320C66x 数字信号处理器 (DSP)
- 带嵌入式视觉引擎 (EVE) 的 Vision AccelerationPac
- 双核 ARM® Cortex®-M4 处理器
此 EVM 还集成了众多外设,包括多摄像头接口(并行和串行)显示屏、CAN 和千兆位以太网 AVB。此外,此 EVM 还集成了以太网、FPD-Link 和 HDMI (...)
TMDSEMU110-U — XDS110 JTAG 调试探针
德州仪器 (TI) 的 XDS110 是一款适用于 TI 嵌入式处理器的新型调试探针(仿真器)。XDS110 取代了 XDS100 系列,同时在单个仓体中支持更广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 Arm® 和 DSP 处理器,所有 XDS 调试探针均支持核心和系统跟踪。 对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE。
德州仪器 (TI) 的 XDS110 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、Arm 10 引脚和 Arm 20 引脚的多个适配器)连接到目标板,通过 (...)
PROCESSOR-SDK-DRA7X — 适用于 DRA7x Jacinto™ 处理器的处理器软件开发套件 – Linux、Android 和 RTOS
Processor SDK Linux Automotive 是用于 TI Jacinto™ DRAx 系列信息娱乐系统 SoC 的基础软件开发平台。使用此软件框架,用户可以为下一代汽车开发功能丰富的信息娱乐系统解决方案,例如可重新配置的数字仪表组、集成式驾驶舱、车载信息娱乐系统、远程信息处理系统、后排娱乐系统等等。该 SDK 基于通用的 Processor SDK 平台。
亮点- 长期稳定 (LTS) 主线 Linux 内核支持
- U-Boot 引导加载程序支持
- Linaro GNU Compiler Collection (GCC) 工具链
- (...)
GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS
VCTR-3P-MICROSAR — 适用于微控制器和高性能计算机 (HPC) 的 Vector MICROSAR AUTOSAR 软件
CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors
- Visualize the device clock tree
- Interact with clock tree (...)
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
FCBGA (ABF) | 367 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点