产品详情

未提供此产品的参数。
FCBGA (ABF) 367 225 mm² 15 x 15
  • Architecture designed for infotainment applications
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • PWMSS
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
    • GPIOs when not used for video
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports
  • Architecture designed for infotainment applications
  • Up to 2 C66x floating-point VLIW DSP
    • Fully object-code compatible with C67x and C64x+
    • Up to thirty-two 16 × 16-bit fixed-point multiplies per cycle
  • Up to 512kB of on-chip L3 RAM
  • Level 3 (L3) and Level 4 (L4) interconnects
  • Memory Interface (EMIF) module
    • Supports DDR3/DDR3L up to DDR-1066
    • Supports DDR2 up to DDR-800
    • Up to 2GB supported
  • Dual Arm® Cortex®-M4 (IPU)
  • Vision accelerationPac
    • Embedded Vision Engine (EVE)
  • Display subsystem
    • Display controller with DMA engine
    • CVIDEO / SD-DAC TV analog composite output
  • On-chip temperature sensor that is capable of generating temperature alerts
  • General-Purpose Memory Controller (GPMC)
  • Enhanced Direct Memory Access (EDMA) controller
  • 3-port (2 external) Gigabit Ethernet (GMAC) switch
  • Controller Area Network (DCAN) module
    • CAN 2.0B protocol
  • Modular Controller Area Network (MCAN) module
    • CAN 2.0B protocol
  • Eight 32-bit general-purpose timers
  • Three configurable UART modules
  • Four Multichannel Serial Peripheral Interfaces (McSPI)
  • Quad SPI interface
  • Two Inter-Integrated Circuit (I2C™) ports
  • Three Multichannel Audio Serial Port (McASP) modules
  • Secure Digital Input Output Interface (SDIO)
  • Up to 126 General-Purpose I/O (GPIO) pins
  • Power, reset, and clock management
  • On-chip debug with CTools technology
  • Automotive AEC-Q100 qualified
  • 15 × 15 mm, 0.65-mm pitch, 367-pin PBGA (ABF)
  • Five instances of Real-Time Interrupt (RTI) modules that can be used as watch dog timers
  • 8-channel 10-bit ADC
  • PWMSS
  • Video and image processing support
    • Full-HD video (1920 × 1080p, 60 fps)
    • Video input and video output
    • GPIOs when not used for video
  • Video Input Port (VIP) module
    • Support for up to 4 multiplexed input ports

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8 mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

The DRA78x processor is offered in a 367-ball, 15×15-mm, 0.65-mm ball pitch (0.8mm spacing rules can be used on signals) with Via Channel™ Array (VCA) technology, ball grid array (FCBGA) package.

The architecture is designed to deliver high-performance concurrencies for automotive co-processor, hybrid radio and amplifier applications in a cost-effective solution, providing full scalability from the DRA75x ("Jacinto 6 EP" and "Jacinto 6 Ex"), DRA74x "Jacinto 6", DRA72x "Jacinto 6 Eco", and DRA71x "Jacinto 6 Entry" family of infotainment processors.

Additionally, Texas Instruments (TI) provides a complete set of development tools for the Arm, and DSP, including C compilers and a debugging interface for visibility into source code execution.

The DRA78x Jacinto 6 RSP (Radio Sound Processor) device family is qualified according to the AEC-Q100 standard.

The device features a simplified power supply rail mapping which enables lower cost PMIC solutions.

下载 观看带字幕的视频 视频

技术文档

未找到结果。请清除搜索并重试。
查看全部 2
类型 标题 下载最新的英语版本 日期
应用手册 Jacinto6 SoC 上 VISION SDK 和 PSDKLA 之间的 IVA-HD 共 享 PDF | HTML 英语版 PDF | HTML 2021年 11月 18日
应用手册 在 Jacinot6 SOC 上集成 VISION SDK 和 PSDK 之间的虚拟 DRM PDF | HTML 英语版 PDF | HTML 2021年 10月 13日

设计和开发

电源解决方案

查找适用于 DRA788 的电源解决方案。TI 提供适用于 TI 和非 TI 片上系统 (SoC)、处理器、微控制器、传感器和现场可编程门阵列 (FPGA) 的电源解决方案。

评估板

DRA78XEVM — DRA78x 评估模块

Jacinto™ DRA78x 评估模块 (EVM) 是一款评估平台,旨在加速无线电信号处理器 (RSP) 应用的开发工作和上市进程。该 EVM 基于采用异构可扩展架构的 Jacinto DRA78x SoC 而构建,该架构包含以下组合:

  • TI 的定点和浮点 TMS320C66x 数字信号处理器 (DSP)
  • 带嵌入式视觉引擎 (EVE) 的 Vision AccelerationPac
  • 双核 ARM® Cortex®-M4 处理器

此 EVM 还集成了众多外设,包括多摄像头接口(并行和串行)显示屏、CAN 和千兆位以太网 AVB。此外,此 EVM 还集成了以太网、FPD-Link 和 HDMI (...)

来源:SVTRONICS INC
用户指南: PDF
调试探针

TMDSEMU110-U — XDS110 JTAG 调试探针

德州仪器 (TI) 的 XDS110 是一款适用于 TI 嵌入式处理器的新型调试探针(仿真器)。XDS110 取代了 XDS100 系列,同时在单个仓体中支持更广泛的标准(IEEE1149.1、IEEE1149.7、SWD)。此外,对于带有嵌入式缓冲跟踪器 (ETB) 的所有 Arm® 和 DSP 处理器,所有 XDS 调试探针均支持核心和系统跟踪。  对于引脚上的内核跟踪,则需要使用 XDS560v2 PRO TRACE

德州仪器 (TI) 的 XDS110 通过 TI 20 引脚连接器(带有适合 TI 14 引脚、Arm 10 引脚和 Arm 20 引脚的多个适配器)连接到目标板,通过 (...)

用户指南: PDF
TI.com 上无现货
软件开发套件 (SDK)

PROCESSOR-SDK-DRA7X — 适用于 DRA7x Jacinto™ 处理器的处理器软件开发套件 – Linux、Android 和 RTOS

Processor SDK Linux Automotive

Processor SDK Linux Automotive 是用于 TI Jacinto™ DRAx 系列信息娱乐系统 SoC 的基础软件开发平台。使用此软件框架,用户可以为下一代汽车开发功能丰富的信息娱乐系统解决方案,例如可重新配置的数字仪表组、集成式驾驶舱、车载信息娱乐系统、远程信息处理系统、后排娱乐系统等等。该 SDK 基于通用的 Processor SDK 平台。

亮点
  • 长期稳定 (LTS) 主线 Linux 内核支持
  • U-Boot 引导加载程序支持
  • Linaro GNU Compiler Collection (GCC) 工具链
  • (...)
用户指南: PDF
操作系统 (OS)

GHS-3P-INTEGRITY-RTOS — Green Hills INTEGRITY RTOS

The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
支持软件

VCTR-3P-MICROSAR — 适用于微控制器和高性能计算机 (HPC) 的 Vector MICROSAR AUTOSAR 软件

MICROSAR 和 DaVinci 产品系列凭借适用于微控制器和 HPC 的先进嵌入式软件和强大的开发工具简化了 ECU 开发。利用先进的基础设施软件,即可为 ECU 奠定良好基础,并使用相关工具简化所有配套开发任务。MICROSAR 嵌入式软件是按照 AUTOSAR classic 和 adaptive 等相关标准开发的。根据 ISO 26262 高达 ASIL D 的安全标准,该软件还适用于安全相关应用。此外,智能网络安全功能可保护控制单元免受未经授权的访问和操纵。Vector 涵盖汽车和其他工业应用的所有用例。对于具有高性能计算机的软件定义车辆 (...)
计算工具

CLOCKTREETOOL — Clock Tree Tool for Sitara™ ARM® Processors

The Clock Tree Tool (CTT) for Sitara™ ARM®, Automotive, and Digital Signal Processors is an interactive clock tree configuration software that provides information about the clocks and modules in these TI devices. It allows the user to:
  • Visualize the device clock tree
  • Interact with clock tree (...)
用户指南: PDF
封装 引脚 CAD 符号、封装和 3D 模型
FCBGA (ABF) 367 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

视频