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TMUX154E

ACTIVE

7.5-pF on-state capacitance, 3.3-V, 2:1 (SPDT), 2-channel analog switch with powered-off protection

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Data sheet

TMUX154E

ACTIVE
Data sheet Order now

Product details

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 3.3 Protocols Analog, I2C, I3C, LVDS, UART Ron (typ) (Ω) 6 CON (typ) (pF) 7.5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 900 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 4.3 Supply voltage (max) (V) 4.3
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 3.3 Protocols Analog, I2C, I3C, LVDS, UART Ron (typ) (Ω) 6 CON (typ) (pF) 7.5 ON-state leakage current (max) (µA) 1 Bandwidth (MHz) 900 Operating temperature range (°C) -40 to 85 Features 1.8-V compatible control inputs, Powered-off protection, Supports input voltage beyond supply Input/output continuous current (max) (mA) 64 Rating Catalog Drain supply voltage (max) (V) 4.3 Supply voltage (max) (V) 4.3
UQFN (RSW) 10 2.52 mm² 1.8 x 1.4 VSSOP (DGS) 10 14.7 mm² 3 x 4.9
  • VCC Operation at 3 V to 4.3 V
  • I/O Pins Can Tolerate up to 5.25 V
  • 1.8-V Compatible Control Logic
  • Supports Powered-off Protection I/O Pins Hi-Z When VCC = 0 V
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 uA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II (1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND (2)
    • 15000-V Human-Body Model

(1)Except EN and SEL Inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
  • VCC Operation at 3 V to 4.3 V
  • I/O Pins Can Tolerate up to 5.25 V
  • 1.8-V Compatible Control Logic
  • Supports Powered-off Protection I/O Pins Hi-Z When VCC = 0 V
  • RON = 10 Ω Maximum
  • ΔRON = 0.35 Ω Typical
  • Cio(ON) = 7.5 pF Typical
  • Low Power Consumption (1 uA Maximum)
  • –3-dB Bandwidth = 900 MHz Typical
  • Latch-Up Performance Exceeds
    100 mA Per JESD 78, Class II (1)
  • ESD Performance Tested Per JESD 22
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O Port to GND (2)
    • 15000-V Human-Body Model

(1)Except EN and SEL Inputs

(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.

The TMUX154E is a high-bandwidth 2:1 switch specially designed for the switching of high-speed signals in applications with limited I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of high-speed signals. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation.

The TMUX154E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.

The TMUX154E is a high-bandwidth 2:1 switch specially designed for the switching of high-speed signals in applications with limited I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of high-speed signals. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation.

The TMUX154E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
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Type Title Date
* Data sheet TMUX154E ESD-Protected, Low Capacitance, 2-Channel, 2:1 Switch, With Powered-off Protection datasheet PDF | HTML 06 Feb 2018
Product overview How to Support Two Controllers on the I2C Bus, Avoid Bus Contention, and Prevent Controller Failures PDF | HTML 27 Nov 2024
Application brief Important Multiplexer Characteristics for I3C Applications PDF | HTML 27 Jul 2023
Application brief Best Practices: I2C Devices on an I3C Shared Bus PDF | HTML 30 Mar 2023
Application brief 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) PDF | HTML 26 Jul 2022
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML 06 Jan 2021
Technical article Roll with the design punches and overcome power-sequencing challenges PDF | HTML 29 Jul 2019
Application brief Improve Stability Issues with Low Con Multiplexers (Rev. A) 10 Dec 2018

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

AM261-SOM-EVM — AM261x control system-on-module evaluation module

AM261-SOM-EVM is an evaluation and development board for the Texas Instruments Sitara™ AM261x series of microcontrollers (MCUs). The System-On-Module design with three 120-pin high-speed, high-density connectors is ideal for initial evaluation and rapid prototyping. An XDS110ISO-EVM is required for (...)

User guide: PDF | HTML
Not available on TI.com
Evaluation board

HSEC180ADAPEVM-AM2 — HSEC180 adapter board for AM261x system-on-module (SOM) evaluation module

This evaluation module is a 180-pin High Speed Edge Card (HSEC) adapter for TI AM261x system-on-module (SOM) platforms, allowing for SOM-based platforms to have backwards compatibility with Sitara™/C2000™ HSEC-based EVMs. The HSEC180ADAPEVM-AM2 connects 180 pins from the SOM board to HSEC pins for (...)

User guide: PDF | HTML
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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Not available on TI.com
Simulation model

TMUX154E TINA-TI Reference Design

SCDM178.TSC (409 KB) - TINA-TI Reference Design
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Simulation model

TMUX154E TINA-TI Spice Model

SCDM179.ZIP (5 KB) - TINA-TI Spice Model
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Package Pins CAD symbols, footprints & 3D models
UQFN (RSW) 10 Ultra Librarian
VSSOP (DGS) 10 Ultra Librarian
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