UCC57102Z-Q1
Low-side 3A/3A driver with desaturation protection and 12V undervoltage lockout
UCC57102Z-Q1
- Qualified for automotive applications
- AEC-Q100 qualified
- Device temperature grade 1
- Typical 3A sink 3A source output currents
- DESAT protection with programmable delay
- Soft turn-off when fault happens
- Absolute maximum VDD voltage: 30V
- Input and enable pins capable of withstanding up to –5V
- Tight UVLO thresholds for bias flexibility
- Typical 26ns propagation delay
- Self-protect driver with thermal shutdown function
- Wide bias voltage range
- Available in 5mm × 4mm SOIC-8 package
- Operating junction temperature range of –40°C to 150°C
The UCC57102Z-Q1 is a single channel, high-performance low-side IGBT/SiC gate driver for high power automotive applications such as PTC heaters, traction inverter active discharge circuit, and other auxiliary subsystems. It offers protection features including Under-voltage-lock-out (UVLO), Desaturation protection (DESAT), FAULT report, and thermal shutdown protection. The UCC57102Z-Q1 has a typical peak drive strength of 3A and it can handle –5V on its inputs, which improves robustness in systems with moderate ground bouncing. The inputs are independent of supply voltage and can be connected to most controller outputs for maximum control flexibility. The wide voltage range of the bias supply provided in the UCC57102Z-Q1 accommodates bipolar voltage. An accurate 5V output LDO is also available with the UCC57102Z-Q1 .
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | UCC57102Z-Q1 High-Speed, Low-Side Gate Driver With DESAT Protection For Automotive Applications datasheet | PDF | HTML | 06 Dec 2024 |
Application brief | Reference Voltage Applications in the UCC57108, UCC57102, and UCC57102Z Gate Drivers | PDF | HTML | 03 Apr 2025 | |
Product overview | UCC571xx: TI's First Protection Low-Side Protection Drivers With DESAT (UCC5710x), OCP (UCC5714x) (Rev. A) | PDF | HTML | 03 Apr 2025 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
UCC57108EVM — UCC57108 evaluation module
The UCC57108EVM is designed to primarily evaluate the UCC57108 functionality. The performance of the driver can be evaluated for capacitive loads or power devices with TO-220 footprints. The UCC57108EVM evaluation boards allow for connection to various test points, such as IN, FLT, DESAT, and VREF, (...)
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.