產品詳細資料

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² (5 mm × 6.4 mm)
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 2023/2/10
白皮書 Automated parking made possible with TI mmWave radar and ultrasonic sensors (Rev. B) PDF | HTML 2023/6/23
應用說明 Ultrasonic Sensing Basics (Rev. D) PDF | HTML 2021/12/2
應用說明 PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 2021/4/7
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 2019/7/15
應用說明 PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 2019/7/12
技術文章 Paving the way with ultrasonic sensing PDF | HTML 2019/6/10
應用說明 PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 2019/2/28
設計指南 Ultrasonic Proximity-Sensing Module (PSM) Reference Design 2018/10/9
使用指南 PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 2018/3/19
Application brief PGA460-Q1 in Ultrasonic Park Assist (UPA) (Rev. A) 2018/1/3
Application brief PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. B) 2018/1/3
技術文章 Where are ultrasonic sensors used? – Part 2 PDF | HTML 2017/10/31
技術文章 Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 2017/9/6
應用說明 PGA460 Software Development Guide (Rev. A) 2017/8/22
技術文章 Where are ultrasonic sensors used? – Part 1 PDF | HTML 2017/6/29
應用說明 PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 2017/5/1
使用指南 PGA460-Q1 EVM Quick Start Guide 2017/2/17

設計與開發

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開發板

BOOSTXL-PGA460 — 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組

利用 BOOSTXL-PGA460 (+ MSP430F5529LP) 全面評估 PGA460 超音波感測器訊號調節器。PGA460 是具有數位訊號處理器的整合式超音波前端,輸出飛時測距資料、回波寬度及振幅資訊。驅動器強度可透過限制變壓器的電流進行配置,而接收器則可進行調整以過濾和處理傳回的回波資料,以進行後量測分析。相關的 PGA460 EVM GUI 可用於自訂、配置和控制超音波設定,以及監控所產生的超音波活動性能。

評估步驟

步驟 1:購買 PGA460-F5529-BNDL(或 BOOSTXL-PGA460 + MSP-EXP430F5529LP)

步驟 2:下載 GUI

步驟 3:下載 (...)
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開發板

PGA460PSM-EVM — PGA460 超音波近距感測評估模組

若運送至歐洲,請訂購等效訊號調節裝置 BOOSTXL-PGA460

PGA460PSM 評估模組 (EVM) 是一款小型解決方案,展示雙面印刷電路板 (PCB) 間距,並符合 PGA460 超音波感測器訊號調節器的支援元件需求。此硬體型號只能在單靜態傳感器模式下操作。單靜態轉換器模式運用單一轉換器來傳送與接收超音波回波。

由於 PGA460 僅能以從屬裝置的方式操作,因此必須搭配一個主控器或處理器,才能進行 PGA460 的設定和運作。此 EVM 的使用指南著重於主要裝置,且僅在與 BOOSTXL-PGA460 評估模組 GUI 軟體配對時,將 MSP-EXP430F5529LP (...)

使用指南: PDF
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程式碼範例或展示

SLAC741 — PGA460 Energia Library and Code Example (Version 1.1.0)

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開發模組 (EVM) 的 GUI

SLAC739 — PGA460-Q1 EVM GUI (Version 1.0.2.0)

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模擬型號

PGA460 IBIS Model

SLAM301.ZIP (65 KB) - IBIS 模型
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參考設計

TIDA-01424 — 車用超音波腳踢開啟參考設計

此參考設計採用超音波感測來偵測踢腿的動作,以辨識使用者何時希望啟動汽車上的電動升降門、電動後車廂或電動滑動門的。  超音波感測可偵測多個物體,並測量每個物體的距離。本設計具備高解析度與低功耗,適用於強調手勢偵測與電池低電流消耗的車用免手持閉合系統。
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參考設計

TIDA-01597 — 停車輔助專用的汽車超音波感測模組參考設計

此參考設計採用三個高度整合的系統單晶片 (SoC) 超音波轉換器驅動器,為停車輔助系統 (PAS) 提供硬體架構。這些超音波轉換器驅動器配備具進階數位訊號處理器 (DSP) 核心的整合式訊號調節器。透過這些整合式功能,即可實現對 25cm 至 2.5m 範圍內物件的偵測。距離資料將透過單線介面 (OWI) 傳送至本機電子控制單元 (ECU),並在此彙總和處理資料。此設計指南中所述的感測器初始化、物件偵測演算法和軟體為開發汽車或防撞 PAS 的工程師提供了基礎架構。
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參考設計

TIDA-060024 — 超音波近距感測模組 (PSM) 參考設計

此參考設計為一小型解決方案,展示雙面 PCB 間距和 PGA460 超音波感測器訊號調節器的最低支援元件需求。此模組以單一感測器發射和接收操作的單靜態模式運作,可在 0.3 至 5m 範圍內透過空氣進行物體偵測。無論環境溫度、濕度或目標物的顏色與透明度,物體偵測皆不受影響;然而,極小或柔軟的目標物可能會影響最大偵測範圍。PGA460 以從屬裝置專用方式運作,需要獨立的主控制器。TI 建議使用 MSPEXP430F5529LP 做為範例主控制器,以重新利用現有 PGA460Q1EVM GUI 和範例原始碼。
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封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian

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