TMP4719
- Supply range: 1.62V to 5.5V
- Wide operating range: –40°C to 125°C
- Remote channel accuracy: 0.8°C
- Resolution: 12-bit (0.0625°C)
- Local channel accuracy: 1°C
- Resolution: 8-bit (1°C)
- Support I2C and SMBus interface
- Low power consumption
- Additional features for improved temperature measurement accuracy:
- Diode non-ideality factor (η-factor) correction
- Series resistance cancellation
- Programmable digital filter
- Remote diode fault detection
- 1.2V logic-compatible input thresholds independent of supply
- Footprint compatible with the TMP432
The TMP4719 device is a high-accuracy 1°C temperature sensor with one local integrated sensor and two remote temperature sensor channels that can be connected to diode-connected transistors, such as the popular MMBT3904 NPN transistor, to replace traditional thermistors or thermocouples. The remote channels can also be connected to a substrate thermal transistor or diode integrated inside microprocessors, microcontrollers, or FPGAs to monitor the die temperature of the IC.
The TMP4719 supports series resistance cancellation, programmable non-ideality factor (η-factor), configurable temperature limits, and programmable digital filters to improve the noise immunity of the device and provide a robust design for complex thermal environment monitoring applications. The device supports I2C and SMBus communication with logic levels down to 1.2V regardless of the main supply rail, enabling interoperability with low-voltage MCUs without needing a secondary low-voltage supply or a bus level shifter.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TMP4719 High-Accuracy 3-Channel (2-Remote and 1-Local) 1.2V Logic Compatible Temperature Sensor with η-Factor 数据表 | PDF | HTML | 2025年 10月 3日 | ||
证书 | TMP4719EVM EU Declaration of Conformity (DoC) | 2025年 3月 21日 |
设计和开发
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TMP4718EVM — TMP4718 远程和本地温度传感器评估模块
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
VSSOP (DGS) | 10 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点