TLV3214-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following results:
- Device temperature grade 1: –40°C to 125°C ambient operating temperature range
- Device HBM ESD classification level H1C
- Device CDM ESD classification level C6
- Propagation delay: 40ns
- Low supply current: 40µA per channel
- Input offset voltage: +/- 5mV maximum
- Internal hysteresis: 1.8mV
- Input voltage range extends 200mV beyond rails
- Power-on Reset (POR) for known start-up
- Push-pull output option (TLV321x-Q1)
- Open-drain output option (TLV322x-Q1)
The TLV321x-Q1 and TLV322x-Q1 are a family of 5V single, dual and quad channel high-speed comparators with push-pull or open-drain output options. The family has an excellent speed-to-power combination with a propagation delay of 40ns and a full supply voltage range of 1.8V to 5V with a quiescent supply current of only 40µA per channel.
These features, along with fast response time, rail-to-rail inputs, low offset voltage and large output drive current make the family well suited for current sensing, zero-cross detection, and a variety of other applications where speed is critical.
The family also includes a Power-on Reset (POR) feature that holds the output in a known state until the minimum supply voltage has been reached to prevent output transients during system power-up and power-down.
The TLV321x-Q1 have a push-pull output stage capable of sinking and sourcing large currents for symmetrical rise and fall times and quickly driving capacitive loads such as MOSFET gates.
The TLV322x-Q1 have an open-drain output that can be pulled-up below or beyond the supply voltage. These devices are designed for low voltage logic translators or combined ORed logic lines.
All devices are specified for operation across the expanded temperature range of –40°C to 125°C.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TLV321x-Q1 and TLV322x-Q1 Automotive 40ns High-Speed Comparators with Rail-to-Rail Input 数据表 | PDF | HTML | 2025年 7月 25日 |
设计和开发
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DIP-Adapter-EVM 套件支持六种常用的业界通用封装,包括:
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封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
TSSOP (PW) | 14 | Ultra Librarian |
订购和质量
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