The TMP144 digital output temperature
sensor can read temperatures to a resolution of 0.0625°C.
The device has a SMAART
Wire™ / UART interface that supports daisy-chain configurations. The
interface also supports Multiple Device Access (MDA) commands that let the host
communicate with multiple devices on the bus simultaneously. MDA commands are used
as an alternative to sending individual commands to each device on the bus. Up to 16
TMP144 devices can be attached together serially and can be read by the host
computer.
The TMP144 device is designed for
space-constrained, power-sensitive applications with multiple temperature
measurement zones that must be monitored. The device is specified for operation over
a temperature range of –40°C to 125°C and is available in three different 4-ball,
low-height wafer chip-scale package (DSBGA) options. The YMT package of the device
has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT
package can be placed under heat-dissipating components on the system for better
accuracy and faster thermal response times.
The TMP144 digital output temperature
sensor can read temperatures to a resolution of 0.0625°C.
The device has a SMAART
Wire™ / UART interface that supports daisy-chain configurations. The
interface also supports Multiple Device Access (MDA) commands that let the host
communicate with multiple devices on the bus simultaneously. MDA commands are used
as an alternative to sending individual commands to each device on the bus. Up to 16
TMP144 devices can be attached together serially and can be read by the host
computer.
The TMP144 device is designed for
space-constrained, power-sensitive applications with multiple temperature
measurement zones that must be monitored. The device is specified for operation over
a temperature range of –40°C to 125°C and is available in three different 4-ball,
low-height wafer chip-scale package (DSBGA) options. The YMT package of the device
has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT
package can be placed under heat-dissipating components on the system for better
accuracy and faster thermal response times.