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HTQFP (PAP) 64 144 mm² 12 x 12
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C1
  • Functional Safety-Compliant
    • Documentation to aid ISO 26262 system design
    • Systematic capability up to ASIL D
    • Hardware capability up to ASIL D
  • Measure 9 to 16 batteries in series per device, stackable up to 64 devices
  • Dedicated ADC with typical ±1mV accuracy
  • Cell voltage and battery pack current measurement synchronized to 64µs
  • Support limp home mode with full redundancy
  • Integrated post-ADC configurable digital low-pass filters
  • Supports busbar without affecting measurement accuracy
  • 12 GPIOs for temp sensor/analog/digital/I2C controller/SPI controller
  • Internal cell balancing
    • Balancing at 300mA
    • User controlled PWM adjustment cell balancing current
    • Built-in balancing thermal management with automatic pause and resume control
  • Robust daisy chain communication and support Ring Architecture
  • Hardware reset by host simulates POR-like event without battery removal
  • Support transformer and capacitive isolation
  • On chip memory for one time custom programming
  • Low power mode current <6µA
  • Compatible with BQ79600-Q1 with SPI/UART interface
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C1
  • Functional Safety-Compliant
    • Documentation to aid ISO 26262 system design
    • Systematic capability up to ASIL D
    • Hardware capability up to ASIL D
  • Measure 9 to 16 batteries in series per device, stackable up to 64 devices
  • Dedicated ADC with typical ±1mV accuracy
  • Cell voltage and battery pack current measurement synchronized to 64µs
  • Support limp home mode with full redundancy
  • Integrated post-ADC configurable digital low-pass filters
  • Supports busbar without affecting measurement accuracy
  • 12 GPIOs for temp sensor/analog/digital/I2C controller/SPI controller
  • Internal cell balancing
    • Balancing at 300mA
    • User controlled PWM adjustment cell balancing current
    • Built-in balancing thermal management with automatic pause and resume control
  • Robust daisy chain communication and support Ring Architecture
  • Hardware reset by host simulates POR-like event without battery removal
  • Support transformer and capacitive isolation
  • On chip memory for one time custom programming
  • Low power mode current <6µA
  • Compatible with BQ79600-Q1 with SPI/UART interface

The BQ79716B-Q1 provides high-accuracy cell voltage measurements for up to 16S battery modules in high-voltage battery management systems in xEV/EV. The monitor offers different channel options in the same package type, providing pin-to-pin compatibility and supporting high reuse of the established software and hardware across any platform. This device has a state-of-the-art ADC architecture/measurement system meeting stringent automotive standard and safety requirements. The device is designed for centralized or distributed architectures in xEV powertrain with the daisy-chain isolated by transformer (or capacitor).

The BQ79716B-Q1 provides high-accuracy cell voltage measurements for up to 16S battery modules in high-voltage battery management systems in xEV/EV. The monitor offers different channel options in the same package type, providing pin-to-pin compatibility and supporting high reuse of the established software and hardware across any platform. This device has a state-of-the-art ADC architecture/measurement system meeting stringent automotive standard and safety requirements. The device is designed for centralized or distributed architectures in xEV powertrain with the daisy-chain isolated by transformer (or capacitor).

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封装 引脚 CAD 符号、封装和 3D 模型
HTQFP (PAP) 64 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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