TypLinCMOS is a trademark of Texas Instruments Incorporated.
The TLV233x operational amplifiers are in a family of devices that has been specifically designed for use in low-voltage single-supply applications. Unlike the TLV2322 which is optimized for ultra-low power, the TLV233x is designed to provide a combination of low power and good ac performance. Each amplifier is fully functional down to a minimum supply voltage of 2 V, is fully characterized, tested, and specified at both 3-V and 5-V power supplies. The common-mode input-voltage range includes the negative rail and extends to within 1 V of the positive rail.
Having a maximum supply current of only 310 uA per amplifier over full temperature range, the TLV233x devices offer a combination of good ac performance and microampere supply currents. From a 3-V power supply, the amplifier's typical slew rate is 0.38 V/us and its bandwidth is 300 kHz.
These amplifiers offer a level of ac performance greater than that of many other devices operating at comparable power levels. The TLV233x operational amplifiers are especially well suited for use in low-current or battery-powered applications.
Low-voltage and low-power operation has been made possible by using the Texas Instruments silicon-gate LinCMOSTM technology. The LinCMOS process also features extremely high input impedance and ultra-low bias currents making these amplifiers ideal for interfacing to high-impedance sources such as sensor circuits or filter applications.
To facilitate the design of small portable equipment, the TLV233x is made available in a wide range of package options, including the small-outline and thin-shrink small-outline package (TSSOP). The TSSOP package has significantly reduced dimensions compared to a standard surface-mount package. Its maximum height of only 1.1 mm makes it particularly attractive when space is critical.
The device inputs and outputs are designed to withstand -100-mA currents without sustaining latch-up. The TLV233x incorporates internal ESD-protection circuits that prevents functional failures at voltages up to 2000 V as tested under MIL-STD 883C, Method 3015.2; however, care should be exercised in handling these devices as exposure to ESD may result in the degradation of the device parametric performance.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | LinCMOS Low-Voltage Medium-Power Operational Amplifiers datasheet | Feb 1, 1997 | |
| E-book | An Engineer’s Guide to Designing with Precision Amplifiers | Apr 29, 2021 | ||
| E-book | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | Mar 28, 2017 |
For additional terms or required resources, click any title below to view the detail page where available.
The amplifier performance development kit (PDK) is an evaluation module (EVM) kit to test common operational amplifier (op amp) parameters and is compatible with most op amps and comparators. The EVM kit offers a main board with several socketed daughtercard options to fit package needs, allowing (...)
Speed up your op amp prototyping and testing with the DIP adapter evaluation module (DIP-ADAPTER-EVM), which provides a fast, easy and inexpensive way to interface with small surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them (...)
The DUAL-DIYAMP-EVM is an evaluation module (EVM) family that provides engineers and do it yourselfers (DIYers) with real-world amplifier circuits, enabling quick evaluation of design concepts and verify simulations. It is designed specifically for dual package op amps in the (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SOIC (D) | 8 | Ultra Librarian |
| TSSOP (PW) | 8 | Ultra Librarian |
| PDIP (P) | 8 | Ultra Librarian |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.