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Logic & Voltage Translation Spotlight
Pulse & Delay (TPUL & TDEL)
Next-gen timing: accurate and easy to use.
Ground-level translators
Resolve ground offset and ground noise in systems
High-drive voltage translation
Boost signals along with level shifting
The Scale of TI Logic & Voltage Translation
Parts shipped last year
Trusted by engineers globally, TI ships billions of logic parts to keep your designs moving.
Years of logic innovation
Decades of logic expertise behind every device, empowering engineers to build with confidence.
Products in our portfolio
With thousands of devices available, TI logic has the right solution for every design challenge.
Advanced wafer fabrication
Built on 300mm wafer fabs, TI delivers the scale and reliability your supply chain demands.
Next-Generation Package Solutions
DTX
TI's DTX package features wettable flanks that enable reliable solder fillet formation along the sides of the leads during PCB assembly. This ensures robust solder joints and compatibility with automated optical inspection (AOI), which is a common requirement for many automotive applications. Additionally, its compact, space-saving footprint makes it an ideal solution for designs where board area is at a premium but board-level reliability cannot be compromised.
Novel Plating Technology for Wettable-Flank QFN and SON Packages (Rev. A)
The value of wettable flank-plated QFN packaging for automotive applications
Make automatic optical inspection easy thanks to packages with wettable flanks
Featured products for our most popular DTX devices
SN74AHCT1G125-Q1ACTIVE
DGS & DYY
The DGS and DYY packages are TI's smallest and most cost-effective leaded package offerings for greater than 14-pin logic functions. Similar to the widely adopted PW package, DGS and DYY offer the same familiar leaded form factor and high channel count capability, but in a smaller footprint and at a more competitive price point. DYY and DGS are 57% and 35% smaller than PW respectively, allowing customers to optimize board space and reduce costs without moving away from a trusted leaded package solution. DYY and DGS packages can also be used in a dual-footprint layout with the PW package, eliminating the need for last-minute board redesigns or spins.
Optimizing Board Space for Discrete LOGIC Designs Using Smallest Package Solutio (Rev. A)
Future-Proofing Your Level Shifter Design with TI's Dual Footprint Packages
Enabling Small Ruggedized Applications with Next-Generation Leaded Logic IC Pkg
Featured products for our most popular DGS/DYY devices
SN74ACT244-Q1ACTIVE
SN74HCS574ACTIVE
SN74HCS74-Q1ACTIVE
BQA/BQB & DPW
BQA/BQB: When high channel count logic is necessary, BQA/BQB delivers one of the smallest footprints available while still providing a 0.5 mm pitch between pins. Its compact form factor maximizes signal density on the PCB, making it a strong fit for space-constrained designs that require a high number of I/Os.
DPW: For low channel count applications, DPW offers an ultra-compact solution in less than 1 mm² — making it one of the smallest logic packages available. Its minimal footprint is purpose-built for designs where board area is at a premium and only a small number of I/Os are needed.
Designing and Manufacturing with TI's X2SON Packages
Save board space with TI’s logic package innovation
Featured products for most popular BQA/BQB & DPW devices
Discover featured applications
Our mission is to be the most trusted global supplier of standard logic products. Our latest technologies provide smaller solutions with enhanced performance.
Popular families:
- Advanced high-speed CMOS (AHC, AHCT) logic is a solution to upgrade your speed performance in low power, noise and drive applications.
- Level-shifting FET (LSF) provides less signal distortion via low ON-state resistance (RON) and flexibility at different voltage translation levels, making it compatible with TTL levels in industrial and telecom applications.
- Advanced ultra-low power (AUP) has the lowest static and dynamic power consumption in the industry, making it the ideal logic technology for portable applications.
Featured resources
- SN74AHCT164 – 4.5-V to 5.5-V 8-bit, parallel-out serial shift registers
- LSF0002 – Ultra-small auto-bidirectional translator for open-drain and push-pull applications
- SN74AUP1T158 – Single 0.8-V to 3.6-V inverter
We continuously release products compliant to the AEC-Q100 standard, adding to our more than 350 automotive logic and voltage translations parts currently available.
Popular Families:
- Low-voltage CMOS (LVC) offers decreased power consumption, high output drive and enhanced ESD protection. LVC products are available in multiple channel options and with an average output drive strength of 24mA (typ) and 32mA (max).
- Schmitt-trigger-integrated high-speed CMOS (HCS) offers a solution to noisy and high power-consuming inputs.
- Translation velocity (TXV) is flexible for high bandwidth and avoids logic-performance issues for applications with timing-margin-sensitive interfaces.
Featured resources
- SN74LVC132A-Q1 – Automotive quadruple positive-NAND gates with Schmitt-trigger inputs
- SN74HCS09-Q1 – Automotive, 4-ch 2-input 2-V to 6-V AND gate with open-drain outputs and Schmitt-trigger inputs</
- TXV0108-Q1 – Automotive, dual-supply direction-controlled eight-channel voltage translator
Our enhanced products (EP) and space enhanced products (SEP) provides rugged commercial-off-the-shelf (COTS) products qualified to meet the Aerospace Qualified Electronic Component (AQEC) standard.
Popular families:
- Space CMOS and voltage translation (SCxT) integrates voltage translation with your logic devices and is radiant tolerant to 30krad TID and up to 43MeV for single-event effects.
- Advanced CMOS (AC, ACT) for higher output drive and TTL compatibility that drives four times more current than our high-speed CMOS (HC, HCT) devices.
- Space low-voltage CMOS (SLC) designed for asynchronous communication between data buses supports low-earth orbit (LEO) space applications, radar comunications and space satellite payloads.
Featured resources
- SN54SC6T14-SEP – Radiation-tolerant, 6-bit inverting fixed-direction level translator with Schmitt-trigger inputs
- SN74ACT04-EP – Enhanced product 6-ch, 4.5-V to 5.5-V inverters with TTL-compatible CMOS inputs
- SN54SLC8T245-SEP – Radiation-tolerant, 8-bit 0.65V to 3.3V, direction-controlled level translator
Find resources to get started
Logic Guide
As electronic systems become increasingly complex, designers face growing challenges in achieving excellent performance, power efficiency, and cost-effectiveness. Read our application note to understand our portfolio and offerings.