TLV7A03
- Ultra-low IQ: 250nA (typ), 400nA (max)
- Shutdown IQ: 3nA (typ)
- Excellent transient response (1mA to 50mA)
- < 10µs settling time
- 80mV undershoot
- Packages:
- 1.0mm × 1.0mm X2SON
- SOT23-5
- Input voltage range: 1.5V to 6.0V
- Output voltage range: 0.8V to 5.0V (fixed)
- Output accuracy: 1.5% over temperature
- Smart enable pulldown
- Very low dropout:
- 270mV (max) at 200mA (VOUT = 3.3V)
- Stable with a 1µF or larger capacitor
The TLV7A03 is an ultra-small, ultra-low quiescent current low-dropout linear regulator (LDO) that sources 200mA with excellent transient performance.
The TLV7A03, with an ultra-low IQ of 250nA, is designed specifically for applications where very low quiescent current is a critical parameter. This device maintains low IQ consumption even in dropout mode to further increase battery life. When in shutdown or disabled mode, the device consumes only 3nA IQ, which helps increase battery shelf life. The TLV7A03 has an output range of 0.8V to 5.0V, available in 50mV steps, to support the lower core voltages of modern microcontrollers (MCUs).
The TLV7A03 features a smart enable circuit with an internally controlled pulldown resistor that keeps the LDO disabled even when the EN pin is floating. This circuit also helps minimize the external components used to pulldown the EN pin. This circuit also helps minimize the current drawn through the external pulldown circuit when the device is enabled.
The TLV7A03 is fully specified for TJ = –40°C to +125°C operation.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | TLV7A03 Nanopower, 250nA IQ , 200mA IOUT , Low-Dropout Regulator With Fast Transient Response 数据表 | PDF | HTML | 2025年 6月 19日 |
设计和开发
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MULTIPKGLDOEVM-823 — 支持 DBV、DRB、DRV 和 DQN 封装的通用 LDO 线性稳压器评估模块
MULTIPKGLDOEVM-823 评估模块 (EVM) 可帮助您评估可能用于电路应用的多种常见线性稳压器封装的操作和性能。这种特殊的 EVM 配置采用 DRB、DRV、DQN 和 DBV 封装,便于您焊接和评估低压降 (LDO) 稳压器。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
X2SON (DQN) | 4 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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