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LMG2656

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具有集成驱动器、保护和电流检测功能的 650V、230mΩ GaN 半桥

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LMG2656

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产品详情

VDS (max) (V) 650 RDS(on) (mΩ) 230 ID (max) (A) 3.6 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VDS (max) (V) 650 RDS(on) (mΩ) 230 ID (max) (A) 3.6 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VQFN (RFB) 19 48 mm² 8 x 6
  • 650V GaN power-FET half bridge
  • 230mΩ low-side and high-side GaN FETs
  • Integrated gate drivers with <100ns low propagation delays
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) / high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side / high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 8mm × 6mm QFN package with dual thermal pads
  • 650V GaN power-FET half bridge
  • 230mΩ low-side and high-side GaN FETs
  • Integrated gate drivers with <100ns low propagation delays
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) / high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side / high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 8mm × 6mm QFN package with dual thermal pads

The LMG2656 is a 650V 230mΩ GaN power-FET half bridge. The LMG2656 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to PCB power ground.

The high-side GaN power FET can be controlled with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2656 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.

The LMG2656 is a 650V 230mΩ GaN power-FET half bridge. The LMG2656 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to PCB power ground.

The high-side GaN power FET can be controlled with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2656 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.
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类型 标题 下载最新的英语版本 日期
* 数据表 LMG2656 650V 230 mΩ GaN Half Bridge With Integrated Driver and Current Sense Emulation 数据表 PDF | HTML 2025年 6月 27日
EVM 用户指南 LMG2656 半桥子卡评估模块 PDF | HTML 英语版 PDF | HTML 2024年 12月 17日

设计和开发

如需其他信息或资源，请点击以下任一标题进入详情页面查看（如有）。

子卡

LMG2656EVM-102 — LMG2656 子卡

LMG2656EVM-102 旨在提供一个快速简便的平台来评估 TI 集成 GaN 器件在任何半桥拓扑中的应用。该电路板设计为使用电路板底部边缘的 6 个电源引脚和 12 个数字引脚以插座式外部连接方式与更大的系统连接。电源引脚形成主开关环路，该环路由高压直流总线、开关节点和电源接地组成。数字引脚通过 PWM 栅极输入来控制 LMG2656 器件，使用低压电源提供辅助电源，并以数字输出形式报告故障信息。基本功率级和栅极驱动、高频电流环路在板上是全封闭的，以最大程度地减少电源环路的寄生电感，从而减少电压过冲，提升性能。使用 TI 的同步降压/升压主板 (LMG342X-BB-EVM) (...)

用户指南: PDF | HTML
英语版: PDF | HTML
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仿真模型

LMG2656 SIMPLIS Model

SNOM812.ZIP (28 KB) - SIMPLIS Model
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计算工具

LMGXX-GAN-LLC-CALC — GaN LLC resonant converter device loss calculator

Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
支持的产品和硬件

支持的产品和硬件

产品
氮化镓 (GaN) 功率级
LMG2100R026 — 100V 2.6mΩ 半桥氮化镓 (GaN) 功率级 LMG2100R044 — 具有集成驱动器和保护功能的 100V 4.4mΩ 半桥 GaN FET LMG2610 — 具有集成驱动器、保护和电流检测功能且适用于 ACF 的 650V 170/248mΩ GaN 半桥 LMG2640 — 具有集成驱动器、保护和电流检测功能的 650V、105mΩ GaN 半桥 LMG2650 — 具有集成驱动器、保护和电流检测功能的 650V、95mΩ GaN 半桥 LMG2652 — 具有集成驱动器、保护和电流检测功能的 650V、140mΩ GaN 半桥 LMG2656 — 具有集成驱动器、保护和电流检测功能的 650V、230mΩ GaN 半桥 LMG3410R050 — 具有集成驱动器和保护功能的 600V 50mΩ GaN LMG3410R070 — 具有集成驱动器和保护功能的 600V 70mΩ GaN LMG3410R150 — 具有集成驱动器和过流保护功能的 600V 150mΩ GaN LMG3411R050 — 具有集成驱动器和逐周期过流保护功能的 600V 50mΩ GaN LMG3411R070 — 具有集成驱动器和逐周期过流保护功能的 600V 70mΩ GaN LMG3411R150 — 具有集成驱动器和逐周期过流保护功能的 600V 150mΩ GaN LMG3422R030 — 具有集成驱动器、保护和温度报告功能的 600V 30mΩ GaN FET LMG3422R050 — 具有集成驱动器、保护和温度报告功能的 600V 50mΩ GaN FET LMG3425R030 — 具有集成驱动器、保护和温度报告功能以及理想二极管模式的 600V 30mΩ GaN FET LMG3425R050 — 具有集成驱动器、保护和温度报告功能以及理想二极管模式的 600V 50mΩ GaN FET LMG3426R030 — 具有集成驱动器、保护和零电压检测功能的 600V 30mΩ GaN FET LMG3426R050 — 具有集成驱动器、保护和零电压检测功能的 600V 50mΩ GaN FET LMG3427R030 — 具有集成驱动器、保护和零电压检测功能的 600V 30mΩ GaN FET LMG3427R050 — 具有集成驱动器、保护和零电压检测功能的 600V 50mΩ GaN FET LMG3522R030 — 具有集成驱动器、保护和温度报告功能的 650V 30mΩ GaN FET LMG3522R030-Q1 — 具有集成驱动器、保护和温度报告功能的汽车类 650V 30mΩ GaN FET LMG3522R050 — 具有集成驱动器、保护和温度报告功能的 650V 50mΩ GaN FET LMG3526R030 — 具有集成驱动器、保护和零电压检测功能的 650V 30mΩ GaN FET LMG3526R050 — 具有集成驱动器、保护和零电压检测报告功能的 650V 50mΩ GaN FET LMG3527R030 — 具有集成驱动器、保护和零电压检测功能的 650V 30mΩ GaN FET LMG5200 — 80V GaN 半桥功率级
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封装 引脚 CAD 符号、封装和 3D 模型
VQFN (RFB) 19 Ultra Librarian
应遵守 TI 评估类商品的标准条款与条件。

订购和质量

包含信息：
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息：
  • 制造厂地点
  • 封装厂地点

支持和培训

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