DRV8818A
- Stepper motor driver
- Simple STEP/DIR interface
- Up to 1/8 microstepping indexer
- Programmable mixed decay, blanking, and off time
- 8V to 35V operating supply voltage range
- Smart tune, slow, fast, and mixed decay options
- High current capacity: 2.5A full-scale, 1.8A RMS
- Low RDS(ON): 310mΩ HS + LS at 24V, 25°C
- Separate logic supply voltage (VCC)
- Pin-to-pin compatible with
- Thermally-enhanced surface mount package
- Protection features
- VM Undervoltage Lockout (UVLO)
- Overcurrent Protection (OCP)
- Thermal Shutdown (TSD)
- Indexer zero position output (HOMEn)
The DRV8818A provides an integrated stepper motor driver for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers and microstepping indexer logic to control a stepper motor.
The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings.
A simple STEP/DIR interface allows controller circuits to be easily interfaced. The mode pins allow for configuration of the motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are programmable.
Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage lockout and overtemperature.
The DRV8818A is packaged in a 28-pin HTSSOP package with PowerPAD™.
技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | DRV8818A 35V, 2.5A Stepper Motor Driver with 1/8 Microstepping, STEP/DIR Interface and Smart Tune Technology 数据表 | PDF | HTML | 2025年 7月 16日 | ||
应用手册 | 所选封装材料的热学和电学性质 | 2008年 10月 16日 |
设计和开发
如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。
DRV8818EVM — DRV8818 评估模块
DRV8818 评估模块 (EVM) 展示了来自德州仪器 (TI) 的 DRV8818 集成微步进电机驱动器的功能和性能。该 EVM 附带板载 MSP430 微处理器(已进行预编程,适合独立操作)。MSP430 的调节电压由 TPS77701 单通道 LDO 提供。此 EVM 可在 8V 至 35V 的电源电压下工作。
封装 | 引脚 | CAD 符号、封装和 3D 模型 |
---|---|---|
HTSSOP (PWP) | 28 | Ultra Librarian |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点
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