产品详情

Number of full bridges 2 Vs (min) (V) 8 Vs ABS (max) (V) 35 Full-scale current (A) 2.5 Peak output current (A) 3.5 RDS(ON) (HS + LS) (mΩ) 370 Sleep current (µA) 3 Control mode STEP/DIR Control interface Hardware (GPIO) Microstepping levels 8 Features Current Regulation, Smart Tune Rating Catalog Operating temperature range (°C) -40 to 85 Decay mode Fast, Mixed, Slow, Smart Tune
Number of full bridges 2 Vs (min) (V) 8 Vs ABS (max) (V) 35 Full-scale current (A) 2.5 Peak output current (A) 3.5 RDS(ON) (HS + LS) (mΩ) 370 Sleep current (µA) 3 Control mode STEP/DIR Control interface Hardware (GPIO) Microstepping levels 8 Features Current Regulation, Smart Tune Rating Catalog Operating temperature range (°C) -40 to 85 Decay mode Fast, Mixed, Slow, Smart Tune
HTSSOP (PWP) 28 62.08 mm² 9.7 x 6.4
  • Stepper motor driver
    • Simple STEP/DIR interface
    • Up to 1/8 microstepping indexer
    • Programmable mixed decay, blanking, and off time
  • 8V to 35V operating supply voltage range
  • Smart tune, slow, fast, and mixed decay options
  • High current capacity: 2.5A full-scale, 1.8A RMS
  • Low RDS(ON): 310mΩ HS + LS at 24V, 25°C
  • Separate logic supply voltage (VCC)
  • Pin-to-pin compatible with
  • Thermally-enhanced surface mount package
  • Protection features
    • VM Undervoltage Lockout (UVLO)
    • Overcurrent Protection (OCP)
    • Thermal Shutdown (TSD)
    • Indexer zero position output (HOMEn)
  • Stepper motor driver
    • Simple STEP/DIR interface
    • Up to 1/8 microstepping indexer
    • Programmable mixed decay, blanking, and off time
  • 8V to 35V operating supply voltage range
  • Smart tune, slow, fast, and mixed decay options
  • High current capacity: 2.5A full-scale, 1.8A RMS
  • Low RDS(ON): 310mΩ HS + LS at 24V, 25°C
  • Separate logic supply voltage (VCC)
  • Pin-to-pin compatible with
  • Thermally-enhanced surface mount package
  • Protection features
    • VM Undervoltage Lockout (UVLO)
    • Overcurrent Protection (OCP)
    • Thermal Shutdown (TSD)
    • Indexer zero position output (HOMEn)

The DRV8818A provides an integrated stepper motor driver for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers and microstepping indexer logic to control a stepper motor.

The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings.

A simple STEP/DIR interface allows controller circuits to be easily interfaced. The mode pins allow for configuration of the motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are programmable.

Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage lockout and overtemperature.

The DRV8818A is packaged in a 28-pin HTSSOP package with PowerPAD™.

The DRV8818A provides an integrated stepper motor driver for printers, scanners, and other automated equipment applications. The device has two H-bridge drivers and microstepping indexer logic to control a stepper motor.

The output driver block for each consists of N-channel power MOSFETs configured as full H-bridges to drive the motor windings.

A simple STEP/DIR interface allows controller circuits to be easily interfaced. The mode pins allow for configuration of the motor in full-step, half-step, quarter-step, or eighth-step modes. Decay mode and PWM off time are programmable.

Internal shutdown functions are provided for over current protection, short circuit protection, under-voltage lockout and overtemperature.

The DRV8818A is packaged in a 28-pin HTSSOP package with PowerPAD™.

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类型 标题 下载最新的英语版本 日期
* 数据表 DRV8818A 35V, 2.5A Stepper Motor Driver with 1/8 Microstepping, STEP/DIR Interface and Smart Tune Technology 数据表 PDF | HTML 2025年 7月 16日
应用手册 所选封装材料的热学和电学性质 2008年 10月 16日

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评估板

DRV8818EVM — DRV8818 评估模块

DRV8818 评估模块 (EVM) 展示了来自德州仪器 (TI) 的 DRV8818 集成微步进电机驱动器的功能和性能。该 EVM 附带板载 MSP430 微处理器(已进行预编程,适合独立操作)。MSP430 的调节电压由 TPS77701 单通道 LDO 提供。此 EVM 可在 8V 至 35V 的电源电压下工作。

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HTSSOP (PWP) 28 Ultra Librarian

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  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
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  • 封装厂地点

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