Product details

Rating Catalog Technology family TXG Applications GPIO, UART Ground offset voltage (max) (V) 10 Bits (#) 4 CMTI (V/µs) 1000 Data rate (max) (Mbps) 250 Vin (min) (V) 1.71 Vin (max) (V) 5.5 Vout (min) (V) 1.71 Vout (max) (V) 5.5 Output type 3-State Topology Push-Pull Forward/reverse channels 2 forward / 2 reverse Isolation rating Functional Prop delay (ns) 5.9 Current consumption per channel (1 Mbps) (typ) (mA) 3.3 Features Partial power down (Ioff)
Rating Catalog Technology family TXG Applications GPIO, UART Ground offset voltage (max) (V) 10 Bits (#) 4 CMTI (V/µs) 1000 Data rate (max) (Mbps) 250 Vin (min) (V) 1.71 Vin (max) (V) 5.5 Vout (min) (V) 1.71 Vout (max) (V) 5.5 Output type 3-State Topology Push-Pull Forward/reverse channels 2 forward / 2 reverse Isolation rating Functional Prop delay (ns) 5.9 Current consumption per channel (1 Mbps) (typ) (mA) 3.3 Features Partial power down (Ioff)
SSOP (DBQ) 16 29.4 mm² 4.9 x 6
  • Supports DC shifts up to ±10V
  • AC Noise Rejection of 20VPP up to 45MHz
  • CMTI of 1kV/µs
  • Low Prop Delay (<5ns) and Ch-Ch Skew (0.35ns)
  • Greater than 250Mbps
  • Low power consumption (0.65mA per channel at 1Mbps, 1.8V)
  • Fully configurable dual-rail design allows each port to operate from 1.71V to 5.5V
  • 4, 2, 1 channel devices with multiple configurations will be available
  • Two device variants:
    • TXG1041: 3 forward, 1 reverse
    • TXG1042: 2 forward, 2 reverse
  • Supports VCC disconnect feature (I/Os are forced into high-Z)
  • Schmitt-trigger inputs allows for slow and noisy signals
  • Inputs with integrated static pull-down resistors prevent channels from floating
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100mA per JESD 78, class II
    • ESD protection exceeds JESD 22
    • 4000V human-body model
    • 500V charged-device model
  • Package options provided:
    • RUC (X2QFN-14)
    • DYY (SOT-14)
    • DBQ (QSOP-16)
  • Supports DC shifts up to ±10V
  • AC Noise Rejection of 20VPP up to 45MHz
  • CMTI of 1kV/µs
  • Low Prop Delay (<5ns) and Ch-Ch Skew (0.35ns)
  • Greater than 250Mbps
  • Low power consumption (0.65mA per channel at 1Mbps, 1.8V)
  • Fully configurable dual-rail design allows each port to operate from 1.71V to 5.5V
  • 4, 2, 1 channel devices with multiple configurations will be available
  • Two device variants:
    • TXG1041: 3 forward, 1 reverse
    • TXG1042: 2 forward, 2 reverse
  • Supports VCC disconnect feature (I/Os are forced into high-Z)
  • Schmitt-trigger inputs allows for slow and noisy signals
  • Inputs with integrated static pull-down resistors prevent channels from floating
  • Operating temperature from –40°C to +125°C
  • Latch-up performance exceeds 100mA per JESD 78, class II
    • ESD protection exceeds JESD 22
    • 4000V human-body model
    • 500V charged-device model
  • Package options provided:
    • RUC (X2QFN-14)
    • DYY (SOT-14)
    • DBQ (QSOP-16)

The TXG104x is a 4-bit, fixed direction, non-galvanic based voltage and ground-level translator that can support both logic-level shifting between 1.71V to 5.5V and ground-level shifting up to ±10V. Compared to traditional level shifters, the TXG104x family can solve the challenges of voltage translation across different ground levels. The Figure 1-1 shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance.

VCCA is referenced to GNDA and VCCB is referenced to GNDB. Ax pins are referenced to VCCA logic level while Bx pins are referenced to VCCB logic levels. Both A port and B port can accept voltages from 1.71V to 5.5V. This device includes two enable pins that can place the respective outputs in a high-impedance state when the OE pin is connected to GND or left floating. In the event of input power or signal loss, the output is default low when OE is High (refer to ). The leakage between GNDA and GNDB is <30nA when VCC to GND is shorted.

The TXG104x device helps improve noise immunity and power sequencing across different ground domains while providing low power consumption, latency and channel-to-channel skew. It can supress noise levels of 20VPP up to 45MHz (Figure 7-4). This device can support multiple interfaces such as SPI, UART, GPIO, and I2S.

The TXG104x is a 4-bit, fixed direction, non-galvanic based voltage and ground-level translator that can support both logic-level shifting between 1.71V to 5.5V and ground-level shifting up to ±10V. Compared to traditional level shifters, the TXG104x family can solve the challenges of voltage translation across different ground levels. The Figure 1-1 shows a common use case where DC shift occurs between GNDA to GNDB due to parasitic resistance or capacitance.

VCCA is referenced to GNDA and VCCB is referenced to GNDB. Ax pins are referenced to VCCA logic level while Bx pins are referenced to VCCB logic levels. Both A port and B port can accept voltages from 1.71V to 5.5V. This device includes two enable pins that can place the respective outputs in a high-impedance state when the OE pin is connected to GND or left floating. In the event of input power or signal loss, the output is default low when OE is High (refer to ). The leakage between GNDA and GNDB is <30nA when VCC to GND is shorted.

The TXG104x device helps improve noise immunity and power sequencing across different ground domains while providing low power consumption, latency and channel-to-channel skew. It can supress noise levels of 20VPP up to 45MHz (Figure 7-4). This device can support multiple interfaces such as SPI, UART, GPIO, and I2S.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 6
Type Title Date
* Data sheet TXG104x 4-Bit, ± 10V Ground-Level Translator datasheet PDF | HTML 14 Mar 2025
Technical article 接地電位不均?以新型的接地電平轉換器解決偏移挑戰 (Rev. A) PDF | HTML 05 Jun 2025
Technical article 접지가 불안정하신가요? 새로운 접지 레벨 트랜스레이터로 오 프셋 문제를 해결하세요. (Rev. A) PDF | HTML 05 Jun 2025
Technical article Uneven grounds? Address offset challenges with novel ground-level translators (Rev. A) PDF | HTML 27 May 2025
Application brief Not All Grounds Are 0V PDF | HTML 21 May 2025
Product overview TI's Latest Ground-Level Translators PDF | HTML 07 May 2025

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

14-24-LOGIC-EVM — Logic product generic evaluation module for 14-pin to 24-pin D, DB, DGV, DW, DYY, NS and PW packages

The 14-24-LOGIC-EVM evaluation module (EVM) is designed to support any logic device that is in a 14-pin to 24-pin D, DW, DB, NS, PW, DYY or DGV package,

User guide: PDF | HTML
Not available on TI.com
Evaluation board

TXG-4CH-EVM — TXG evaluation module for 4-channel ground-level translator

TXG-4CH-EVM is an evaluation module (EVM) used to evaluate the TXGx04x 4-channel ground-level translator product family. The EVM supports multiple package options, which include 16-pin DBQ, 14-pin DYY, and 14-pin RUC. The EVM features multiple test points and connection options to evaluate the (...)
User guide: PDF | HTML
Not available on TI.com
Package Pins CAD symbols, footprints & 3D models
SSOP (DBQ) 16 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos