TX75E16
- Transmitter supports:
- 16-channel 5-level pulser and active transmit/receive (T/R) switch
- 5-level pulser:
- Maximum output voltage: ±100V
- Minimum output voltage: ±1V
- Maximum output current: 2A
- Supports 4A output current mode.
- True return to zero to discharge output to ground
- Second harmonic of –45dBc at 5MHz
- –3dB Bandwidth with 1kΩ || 240pF load
- 20MHz for a ±100V supply
- 25MHz for a ±70V supply
- 35MHz for a ±100V supply in 4A mode
- Integrated jitter: 100 fs measured from 100Hz to 20kHz
- CW mode close-in phase noise: –154dBc/Hz at 1kHz offset for 5MHz signal
- Very low receive power: 1mW/ch
- Programmable load damp resistor: 200Ω, 100Ω or 67Ω
- Active transmit/receive (T/R) switch with:
- Turn-on resistance: 8Ω
- Turn-on and turn-off time: 100ns
- Transient glitch: 10mVPP
- On-chip beam former with:
- Channel based T/R switch on and off controls
- Delay resolution: half beamformer clock period, minimum 2 ns
- Maximum delay: 214 beamformer clock period
- Maximum beamformer clock speed: 320MHz
- Per channel pattern control with 2K distinct level
- Global and local repeat pattern, enabling long duration patterns for Shear Wave imaging
- Supports 120 delay profiles
- High-speed (400 MHz maximum), 2-lane LVDS serial programming interface.
- Low programming time: < 500ns for delay profile update
- 32-bit checksum feature to detect wrong SPI writes
- Supports CMOS serial programming interface (50MHz maximum)
- Internal temperature sensor and automatic thermal shutdown
- No specific power sequencing requirement
- Error flag register to detect faulty conditions
- Integrated passives for the floating supplies and bias voltages
- Small package: FC-BGA-144 (10mm × 10mm) with 0.8mm pitch
The TX75E16 is a highly integrated, high-performance transmitter for ultrasound imaging system. The device has total 16 pulser circuits, 16 transmit/receive switches (referred as T/R or TR switches), and supports on-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.
The TX75E16 has a pulser circuit that generates five-level high voltage pulses (up to ±100V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 16 outputs. The maximum output current is 2A.
The device can be used as a transmitter for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.
The TX75E16 (referred as device in this data sheet) is highly integrated transmitter targeted for exciting ultrasound transducers. Device integrates 16 pulsers and 16 T/R switches, on-chip beamformer, and pattern generator.
The device integrates all the decoupling capacitors required for the floating supplies and internal bias voltages. This integration significantly reduces the required number of external capacitors. The TX75E16 is available in a 10mm × 10mm 144-pin FC-BGA package (ALH package) and is specified for operation from 0°C to 70°C.
Pulser circuit generates five-level high voltage pulses (up to ±100 V) with maximum output current of 2A. When pulser transmits the high voltage pulses, T/R switch turns OFF and protects the low voltage receiver circuit from damage. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is controlled by on-chip beamforming engine in the device. The T/R switch offers 8Ω impedance in the ON state.
Ultrasound transmission relies on excitation of multiple transducer elements, with different delay values defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX75E16 supports staggered pulsing of the different channels, allowing for transmit beamforming.
In the on-chip beamformer mode, delay profile for pulsing of different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 214 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Each channel has a RAM, which is 960 words long. The patterns have global and local repeats feature. This capability can be used to generate long patterns and can be used in Shear-Wave imaging.
These pattern profiles and delay profiles are written using a high-speed (400 MHz) serial peripheral interface. The high-speed writes can be prone to errors, therefore the device has a checksum feature to detect errors in SPI writes.
To protect the device from getting damaged because of improper configuration, an internal error flag register can detect faulty condition and configure the device in shutdown mode automatically.

Request more information
The full data sheet and other design resources are available. Request now
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | TX75E16 5-Level, 16-Channel Transmitter with T/R Switch, On-Chip Beamformer, and Enhanced Load Damping Features datasheet (Rev. A) | PDF | HTML | 24 Jul 2025 |
Application note | An Overview of TI's Transmitter Products for Ultrasound Applications | 08 Jul 2025 | ||
Product overview | Optimizing the Size of Handheld Ultrasound Front-End Circuit Designs | PDF | HTML | 15 Dec 2023 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
TX75E16EVM — TX75E16 evaluation module
The TX75E16 evaluation module (EVM) evaluates the TX75E16 device and its features.
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
FCCSP (ALH) | 144 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.