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SN74LV4051A-Q1

ACTIVE

Automotive, 5V, 8:1, 1-channel, analog multiplexer

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Data sheet

SN74LV4051A-Q1

ACTIVE
Data sheet Order now

Product details

Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 22 CON (typ) (pF) 23.4 ON-state leakage current (max) (µA) 2 Bandwidth (MHz) 35 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (A) 0.025 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
Configuration 8:1 Number of channels 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog Ron (typ) (Ω) 22 CON (typ) (pF) 23.4 ON-state leakage current (max) (µA) 2 Bandwidth (MHz) 35 Operating temperature range (°C) -40 to 125 Input/output continuous current (max) (A) 0.025 Rating Automotive Drain supply voltage (max) (V) 5.5 Supply voltage (max) (V) 5.5
SOIC (D) 16 59.4 mm² 9.9 x 6 SOIC (DW) 16 106.09 mm² 10.3 x 10.3 SOT-23-THN (DYY) 16 8.4 mm² 4.2 x 2 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • 1.65V to 5.5V VCC operation
  • Supports mixed-mode voltage operationon all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 100mAper JESD 78, class II
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature range
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • 1.65V to 5.5V VCC operation
  • Supports mixed-mode voltage operationon all ports
  • High on-off output-voltage ratio
  • Low crosstalk between switches
  • Individual switch controls
  • Extremely low input current
  • Latch-up performance exceeds 100mAper JESD 78, class II

This 8-channel CMOS analog multiplexer and demultiplexer is designed for 1.65V to 5.5V VCC operation.

The SN74LV4051A-Q1 handles analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.

This 8-channel CMOS analog multiplexer and demultiplexer is designed for 1.65V to 5.5V VCC operation.

The SN74LV4051A-Q1 handles analog and digital signals. Each channel permits signals with amplitudes up to 5.5V (peak) to be transmitted in either direction.

Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems.
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Technical documentation

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* Data sheet SN74LV4051A-Q1 Automotive 8-Channel Analog Multiplexer or Demultiplexer datasheet (Rev. H) PDF | HTML 02 Oct 2024
Functional safety information SN74LV405xA-Q1 Functional Safety FIT Rate, FMD and Pin FMA (Rev. A) PDF | HTML 21 Feb 2025
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML 01 Dec 2021
More literature Automotive Logic Devices Brochure 27 Aug 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

16DYYPWEVM — Test board for SOT-23 THIN (DYY) and TSSOP (PW) packages

The 16DYYPWEVM test board provides a dual footprint for SOT-23 THIN (DYY) and TSSOP (PW) packages.  This test board is used for quick prototyping and testing of integrated ciructs in 16 pin SOT-23 THIN (DYY) and TSSOP (PW) packages. 
User guide: PDF
Not available on TI.com
Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
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Design guide: PDF
Schematic: PDF
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This reference design provides an electronics subsystem designed to drive an automotive augmented reality (AR) head-up display (HUD). DLP® technology enables bright, crisp, highly saturated head-up displays that project critical driving information onto the windshield of the car, reducing (...)
Design guide: PDF
Schematic: PDF
Reference designs

TIDA-020008 — Automotive power seat reference design

This reference design provides the drive and control circuits for motor-driven applications such as automotive power seats, using both bi-directional and unidirectional motor drives. It demonstrates how to drive brushed DC motors with a small board footprint, a high degree of robustness and full (...)
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Schematic: PDF
Package Pins CAD symbols, footprints & 3D models
SOIC (D) 16 Ultra Librarian
SOIC (DW) 16 Ultra Librarian
SOT-23-THN (DYY) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

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