SN74CBTLV3383

Name: SN74CBTLV3383
Brand: TI
SKU: SN74CBTLV3383
Price: 0.245 USD

ACTIVE

3.3-V, crosspoint/exchange, 10-channel FET bus switch

Order now

Data sheet

document-pdfAcrobat SN74CBTLV3383 Low-Voltage 10-Bit FET Bus-Exchange Switch datasheet (Rev. H) PDF | HTML

SN74CBTLV3383

ACTIVE

Data sheet

Order now

Product details

Protocols

Analog

Configuration

Crosspoint/exchange

Number of channels

Bandwidth (MHz)

200

Supply voltage (max) (V)

3.6

Ron (typ) (mΩ)

5000

Input/output voltage (min) (V)

Input/output voltage (max) (V)

3.6

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (mA)

128

COFF (typ) (pF)

13.5

OFF-state leakage current (max) (µA)

Ron (max) (mΩ)

40000

VIH (min) (V)

VIL (max) (V)

0.8

Rating

Catalog

Protocols

Analog

Configuration

Crosspoint/exchange

Number of channels

Bandwidth (MHz)

200

Supply voltage (max) (V)

3.6

Ron (typ) (mΩ)

5000

Input/output voltage (min) (V)

Input/output voltage (max) (V)

3.6

Operating temperature range (°C)

-40 to 85

Input/output continuous current (max) (mA)

128

COFF (typ) (pF)

13.5

OFF-state leakage current (max) (µA)

Ron (max) (mΩ)

40000

VIH (min) (V)

VIL (max) (V)

0.8

Rating

Catalog

SOIC (DW)

159.65 mm² 15.5 x 10.3

SSOP (DBQ)

51.9 mm² 8.65 x 6

TSSOP (PW)

49.92 mm² 7.8 x 6.4

TVSOP (DGV)

32 mm² 5 x 6.4

5-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A
- 200-V Machine Model (A115-A)

5-Ω Switch Connection Between Two Ports
Rail-to-Rail Switching on Data I/O Ports
I_off Supports Partial-Power-Down Mode Operation
Latch-Up Performance Exceeds 250 mA Per JESD 17
ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A
- 200-V Machine Model (A115-A)

The SN74CBTLV3383 provides ten bits of high-speed bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device operates as a 10-bit bus switch or as a 5-bit bus exchanger, which provides swapping of the A and B pairs of signals. The bus-exchange function is selected when BX is high, and BE is low.

This device is fully specified for partial-power-down applications using I_off. The I_off feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

The SN74CBTLV3383 provides ten bits of high-speed bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device operates as a 10-bit bus switch or as a 5-bit bus exchanger, which provides swapping of the A and B pairs of signals. The bus-exchange function is selected when BX is high, and BE is low.

filter

Find other Protocol & bus switches & muxes

Download View video with transcript Video

Technical documentation

star

=Top documentation for this product selected by TI

No results found. Please clear your search and try again.

View all 18

Top documentation	Type	Title	Format options	Date
*	Data sheet	SN74CBTLV3383 Low-Voltage 10-Bit FET Bus-Exchange Switch datasheet (Rev. H)	PDF \| HTML	14 Nov 2018
	Selection guide	Logic Guide (Rev. AC)	PDF \| HTML	13 Nov 2025
	Application note	Selecting the Correct Texas Instruments Signal Switch (Rev. E)	PDF \| HTML	02 Jun 2022
	Application note	Multiplexers and Signal Switches Glossary (Rev. B)	PDF \| HTML	01 Dec 2021
	Application brief	Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C)	PDF \| HTML	06 Jan 2021
	Selection guide	Little Logic Guide 2018 (Rev. G)		06 Jul 2018
	Application note	How to Select Little Logic (Rev. A)		26 Jul 2016
	Application note	Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)		02 Dec 2015
	User guide	LOGIC Pocket Data Book (Rev. B)		16 Jan 2007
	More literature	Digital Bus Switch Selection Guide (Rev. A)		10 Nov 2004
	Product overview	Design Summary for WCSP Little Logic (Rev. B)		04 Nov 2004
	Application note	Semiconductor Packing Material Electrostatic Discharge (ESD) Protection		08 Jul 2004
	User guide	Signal Switch Data Book (Rev. A)		14 Nov 2003
	Application note	Bus FET Switch Solutions for Live Insertion Applications		07 Feb 2003
	Application note	Texas Instruments Little Logic Application Report		01 Nov 2002
	Application note	TI IBIS File Creation, Validation, and Distribution Processes		29 Aug 2002
	More literature	Standard Linear & Logic for PCs, Servers & Motherboards		13 Jun 2002
	User guide	CBT (5-V) And CBTLV (3.3-V) Bus Switches Data Book (Rev. B)		01 Dec 1998

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.

User guide: PDF