OPT8320
- Imaging Array:
- 80 × 60 Array
- 1/6” Sensor Format
- Pixel Pitch: 30 µm
- Frame Rate: Scalable Up to 1000-FPS Depth Output Rate with an Internal Raw Rate of 4000 FPS
- Optical Properties:
- Responsivity: 0.35 A/W at 850 nm
- Demodulation Contrast: 70% at 50 MHz
- Demodulation Frequency: 10 MHz to 100 MHz
- Output Interface:
- Digital Video Port (DVP): 8 Data Lanes,
HD and VD Pins, and Clock - Synchronous Serial Interface (SSI):
1 Data Lane, Clock, and Chip Select
- Digital Video Port (DVP): 8 Data Lanes,
- Timing Generator:
- Sensor Addressing Engine
- Modulation Control
- De-Aliasing
- Master, Slave Sync Operation
- High Dynamic Range Operation
- Depth Engine:
- Pixel Binning
- De-Aliasing
- Histogram
- Calibration
- Power Supply:
- 3.3-V I/O, Analog
- 1.8-V Analog, Digital, I/O
- 1.8-V Demodulation (Typical)
- Optimized Optical Package (COG-56):
- 8.03 mm × 5.32 mm × 0.745 mm
- Integrated Optical Band-Pass Filter
(830 nm to 867 nm) - Optical Fiducials for Easy Alignment
- Built-In Illumination Driver for Low-Power Applications
- Operating Temperature: 0°C to 70°C
The OPT8320 time-of-flight (ToF) sensor is part of the TI 3D ToF image sensor family. The device is a high-performance, highly-integrated, complete system-on-chip (SoC) for array depth sensing, consisting of a versatile timing generator (TG), an optimally designed analog-to-digital converter (ADC), a depth engine, and an illumination driver.
The programmability of the built-in TG offers the flexibility to optimize for various depth-sensing performance metrics [such as power, motion robustness, signal-to-noise ratio (SNR), and ambient cancellation]. The built-in depth engine computes the depth data from the digitized sensor data. In addition to the phase data, the depth engine provides auxiliary information consisting of amplitude, ambient, and flags for each pixel and the full-array statistical information in the form of a histogram.

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技术文档
类型 | 标题 | 下载最新的英语版本 | 日期 | |||
---|---|---|---|---|---|---|
* | 数据表 | OPT8320 3D 飞行时间传感器(短) 数据表 | 2018年 4月 24日 |
订购和质量
- RoHS
- REACH
- 器件标识
- 引脚镀层/焊球材料
- MSL 等级/回流焊峰值温度
- MTBF/时基故障估算
- 材料成分
- 鉴定摘要
- 持续可靠性监测
- 制造厂地点
- 封装厂地点