The TPSM560R6 power module is a highly integrated
600-mA power solution that combines a 60-V input, step-down DC/DC converter with
power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN
package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses Enhanced HotRod QFN
technology for enhanced thermal performance, small footprint, and low EMI. The
package footprint has all pins accessible from the perimeter and a single large
thermal pad for simple layout and easy handling in manufacturing.
The TPSM560R6 is a compact, easy-to-use power
module with a wide adjustable output voltage range of 1.0 V to 6 V. The total
solution requires as few as four external components and eliminates the loop
compensation and magnetics part selection from the design process. The full feature
set includes power good, programmable UVLO, prebias start-up, overcurrent, and
temperature protections, making the TPSM560R6 an excellent device for powering a
wide range of applications. Space-constrained applications benefit from the 5.0-mm ×
5.5-mm package.
The TPSM560R6 power module is a highly integrated
600-mA power solution that combines a 60-V input, step-down DC/DC converter with
power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN
package. The 5.0-mm × 5.5-mm × 4.0-mm, 15-pin QFN package uses Enhanced HotRod QFN
technology for enhanced thermal performance, small footprint, and low EMI. The
package footprint has all pins accessible from the perimeter and a single large
thermal pad for simple layout and easy handling in manufacturing.
The TPSM560R6 is a compact, easy-to-use power
module with a wide adjustable output voltage range of 1.0 V to 6 V. The total
solution requires as few as four external components and eliminates the loop
compensation and magnetics part selection from the design process. The full feature
set includes power good, programmable UVLO, prebias start-up, overcurrent, and
temperature protections, making the TPSM560R6 an excellent device for powering a
wide range of applications. Space-constrained applications benefit from the 5.0-mm ×
5.5-mm package.