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TPSI2260-Q1

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Automotive 600V, 50mA isolated switch with reinforced isolation and avalanche protection

Product details

FET Internal Number of channels 1 Withstand isolation voltage (VISO) (Vrms) 5000 Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 20 Rating Automotive Features 2-mA avalanche current, Capacitive isolation Switching voltage (max) (V) 600 Imax (mA) 50 Ron (typ) (Ω) 70 TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125 OFF-state leakage current (µA) 1 Isolation rating Reinforced Surge isolation voltage (VIOSM) (VPK) 10000 Working isolation voltage (VIOWM) (Vrms) 1000
FET Internal Number of channels 1 Withstand isolation voltage (VISO) (Vrms) 5000 Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 20 Rating Automotive Features 2-mA avalanche current, Capacitive isolation Switching voltage (max) (V) 600 Imax (mA) 50 Ron (typ) (Ω) 70 TI functional safety category Functional Safety-Capable Operating temperature range (°C) -40 to 125 OFF-state leakage current (µA) 1 Isolation rating Reinforced Surge isolation voltage (VIOSM) (VPK) 10000 Working isolation voltage (VIOWM) (Vrms) 1000
SOIC (DWQ) 11 106.09 mm² 10.3 x 10.3
  • Qualified for automotive applications
    • AEC-Q100 grade 1: –40 to 125°C TA
  • Low EMI:
    • Meets CISPR25 class 5 performance with no additional components
  • Integrated avalanche rated MOSFETs
    • Designed and qualified for reliability for dielectric withstand testing (Hi-Pot)
      • TPSI2260-Q1: IAVA =1mA for 60s pulses
      • TPSI2260T-Q1: IAVA = 3mA for 60s pulses
    • 600V standoff voltage
    • RON = 65Ω (TJ = 25°C)
    • IOFF = 1.22µA at 500V (TJ = 105°C)
  • Low primary side supply current
    • 9mA ON state current
  • Robust isolation barrier:
    • > 38 year projected lifetime at 1000VRMS / 1500VDC working voltage
    • Reinforced isolation rating, VISO, up to 5000VRMS
  • SOIC 11-pin (DWQ) package with wide pins for improved thermal performance
    • Creepage and clearance ≥ 8mm (primary-secondary)
    • Creepage and clearance ≥ 6mm (across switch terminals)
  • Safety-Related Certifications
    • (Planned) DIN VDE V 0884-17:2021-10
    • (Planned) UL 1577 component recognition program
  • Qualified for automotive applications
    • AEC-Q100 grade 1: –40 to 125°C TA
  • Low EMI:
    • Meets CISPR25 class 5 performance with no additional components
  • Integrated avalanche rated MOSFETs
    • Designed and qualified for reliability for dielectric withstand testing (Hi-Pot)
      • TPSI2260-Q1: IAVA =1mA for 60s pulses
      • TPSI2260T-Q1: IAVA = 3mA for 60s pulses
    • 600V standoff voltage
    • RON = 65Ω (TJ = 25°C)
    • IOFF = 1.22µA at 500V (TJ = 105°C)
  • Low primary side supply current
    • 9mA ON state current
  • Robust isolation barrier:
    • > 38 year projected lifetime at 1000VRMS / 1500VDC working voltage
    • Reinforced isolation rating, VISO, up to 5000VRMS
  • SOIC 11-pin (DWQ) package with wide pins for improved thermal performance
    • Creepage and clearance ≥ 8mm (primary-secondary)
    • Creepage and clearance ≥ 6mm (across switch terminals)
  • Safety-Related Certifications
    • (Planned) DIN VDE V 0884-17:2021-10
    • (Planned) UL 1577 component recognition program

The TPSI2260-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2260-Q1 uses TI’s high reliability reinforced capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply. The TPSI2260-Q1 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wearout or photo degradation failure modes common in mechanical relay and photo relay components.

The primary side of the device is powered by only 9mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 4.5V–20V and the EN pin of the device should be driven by a GPIO output with Logic low between 2.1V–20V.

The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±600V from S1 to S2. The TPSI2260-Q1 MOSFET avalanche robustness and thermally conscious package design allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 1mA without requiring any external components.

The TPSI2260-Q1 is an isolated solid state relay designed for high voltage automotive and industrial applications. The TPSI2260-Q1 uses TI’s high reliability reinforced capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated solution requiring no secondary side power supply. The TPSI2260-Q1 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wearout or photo degradation failure modes common in mechanical relay and photo relay components.

The primary side of the device is powered by only 9mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device should be connected to a system supply between 4.5V–20V and the EN pin of the device should be driven by a GPIO output with Logic low between 2.1V–20V.

The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±600V from S1 to S2. The TPSI2260-Q1 MOSFET avalanche robustness and thermally conscious package design allow it to robustly support system level dielectric withstand testing (HiPot) and DC fast charger surge currents of up to 1mA without requiring any external components.

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* Data sheet TPSI2260-Q1 600V, 50mA, Automotive Reinforced Solid-State Relay With Avalanche Protection datasheet PDF | HTML 02 Jun 2025
EVM User's guide TPSI2260-Q1 Evaluation Module User's Guide PDF | HTML 05 Jun 2025
Certificate TPSI2260Q1EVM EU Declaration of Conformity (DoC) 24 Jan 2025

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TPSI2260Q1EVM — TPSI2260-Q1 evaluation module

The TPSI2260Q1EVM is a hardware evaluation module (EVM) containing multiple test points and jumpers to fully evaluate the performance and functionality of the device. The evaluation module contains everything needed to test and assess the TPSI2260-Q1 before designing into part of the power system (...)
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PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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