SN74CBTLV3857

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Product details

Protocols Analog Configuration 1:1 SPST Number of channels 10 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 48 COFF (typ) (pF) 5 OFF-state leakage current (max) (µA) 1000 Ron (max) (mΩ) 40000 VIH (min) (V) Vref+180mV VIL (max) (V) Vref-180mV Rating Catalog
Protocols Analog Configuration 1:1 SPST Number of channels 10 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 48 COFF (typ) (pF) 5 OFF-state leakage current (max) (µA) 1000 Ron (max) (mΩ) 40000 VIH (min) (V) Vref+180mV VIL (max) (V) Vref-180mV Rating Catalog
SOIC (DW) 24 159.65 mm² (15.5 mm × 10.3 mm)
  • Enable Signal Is SSTL_2 Compatible
  • Flow-Through Architecture Optimizes PCB Layout
  • Designed for Use With 200 Mbit/s Double Data-Rate (DDR) SDRAM Applications
  • Switch On-State Resistance Is Designed to Eliminate Series Resistor to DDR SDRAM
  • Internal 10-k Pulldown Resistors to Ground on B Port
  • Internal 50-k Pullup Resistor on Output-Enable Input
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Enable Signal Is SSTL_2 Compatible
  • Flow-Through Architecture Optimizes PCB Layout
  • Designed for Use With 200 Mbit/s Double Data-Rate (DDR) SDRAM Applications
  • Switch On-State Resistance Is Designed to Eliminate Series Resistor to DDR SDRAM
  • Internal 10-k Pulldown Resistors to Ground on B Port
  • Internal 50-k Pullup Resistor on Output-Enable Input
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II

This 10-bit FET bus switch is designed for 3-V to 3.6-V VCC operation and SSTL_2 output-enable (OE\) input levels.

When OE\ is low, the 10-bit bus switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports. There are 10-k pulldown resistors to ground on the B port.

The FET switch on-state resistance is designed to replace the series terminating resistor in the SSTL_2 data path.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

This 10-bit FET bus switch is designed for 3-V to 3.6-V VCC operation and SSTL_2 output-enable (OE\) input levels.

When OE\ is low, the 10-bit bus switch is on, and port A is connected to port B. When OE\ is high, the switch is open, and the high-impedance state exists between the two ports. There are 10-k pulldown resistors to ground on the B port.

The FET switch on-state resistance is designed to replace the series terminating resistor in the SSTL_2 data path.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74CBTLV3857 datasheet (Rev. E) Oct 13, 2003
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML Jan 6, 2021

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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Simulation model

SN74CBTLV3857 IBIS Model

SCDM053.ZIP (28 KB) - IBIS model
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SOIC (DW) 24 Ultra Librarian

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