SN74CBTLV3251

ACTIVE

Product details

Protocols Analog Configuration 8:1 Number of channels 1 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 6 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 2 VIL (max) (V) 0.8 Rating Catalog
Protocols Analog Configuration 8:1 Number of channels 1 Bandwidth (MHz) 200 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Operating temperature range (°C) -40 to 85 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 6 OFF-state leakage current (max) (µA) 1 Ron (max) (mΩ) 40000 VIH (min) (V) 2 VIL (max) (V) 0.8 Rating Catalog
VQFN (RGY) 16 14 mm² (4 mm × 3.5 mm) TSSOP (PW) 16 32 mm² (5 mm × 6.4 mm) SOIC (D) 16 59.4 mm² (9.9 mm × 6 mm) TVSOP (DGV) 16 23.04 mm² (3.6 mm × 6.4 mm) SSOP (DBQ) 16 29.4 mm² (4.9 mm × 6 mm)
  • 5Ω Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II
  • 5Ω Switch Connection Between Two Ports
  • Rail-to-Rail Switching on Data I/O Ports
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100mA Per JESD 78, Class II

The SN74CBTLV3251 device is a 1-of-8 high-speed FET multiplexer/demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The select inputs (S0, S1, S2) control the data flow. The FET multiplexers/demultiplexers are disabled when the output-enable ( OE) input is high. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature is designed so that damaging current cannot backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN74CBTLV3251 device is a 1-of-8 high-speed FET multiplexer/demultiplexer. The low on-state resistance of the switch allows connections to be made with minimal propagation delay. The select inputs (S0, S1, S2) control the data flow. The FET multiplexers/demultiplexers are disabled when the output-enable ( OE) input is high. This device is fully specified for partial-power-down applications using Ioff. The Ioff feature is designed so that damaging current cannot backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE must be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Download View video with transcript Video

Technical documentation

No results found. Please clear your search and try again.
View all 4
Top documentation Type Title Format options Date
* Data sheet SN74CBLTV3251 Low-Voltage 1-OF-8 FET Multiplexer/Demultiplexer datasheet (Rev. J) PDF | HTML Jul 15, 2026
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Application brief Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) PDF | HTML Jan 6, 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Supported products & hardware
In stock
Limit:
??asset.out-of-stock-ti_en_US??
Not available
Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
Supported products & hardware
In stock
Limit:
??asset.out-of-stock-ti_en_US??
Not available
Simulation model

SN74CBTLV3251 IBIS Model

SCDM071.ZIP (25 KB) - IBIS model
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
VQFN (RGY) 16 Ultra Librarian
TSSOP (PW) 16 Ultra Librarian
SOIC (D) 16 Ultra Librarian
TVSOP (DGV) 16 Ultra Librarian
SSOP (DBQ) 16 Ultra Librarian

Ordering & quality

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos