LP-EM-CC2745R10-Q1
CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件
LP-EM-CC2745R10-Q1
概述
此 LaunchPad™ 开发套件可加快具有集成功率放大器和无线电支持(支持 2.4GHz 运行)的器件的开发速度。此 LaunchPad 配备了一个符合 AEC-Q100 标准的无线微控制器 (MCU),支持适用于汽车应用的低功耗 Bluetooth®(5.3 和即将推出的版本)。这是一个分离式 LaunchPad™ 开发套件,意味着不包含 XDS 调试器。推荐使用 LP-XDS110 或 LP-XDS110ET 调试器。
特性
- 适用于带有集成式 PCB 布线天线的无线应用、具有 2.4GHz 无线电的 LaunchPad™ 开发套件
- 协议支持包括低功耗 Bluetooth® 和 2.4GHz 专有射频
- 需要单独购买用于软件开发和射频评估的调试器(LP-XDS110 或 LP-XDS110ET)
低功耗 2.4GHz 产品
汽车类无线连接产品
立即订购并开发
LP-EM-CC2745R10-Q1 — CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件
SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices
SMARTRF-STUDIO-8 — SmartRF Studio 8 application software for CC23xx and CC27xx devices
Compressed source file archive
Compressed source file archive
产品
低功耗 2.4GHz 产品
汽车类无线连接产品
硬件开发
评估板
发布信息
SmartRF Studio 8 is an application tool that allows users to configure, test and evaluate Simplelink RF devices from Texas Instruments. The application helps RF designers to easily evaluate the radio at an early stage in the design process. SmartRF Studio can be used either as a standalone application or together with supported evaluation boards or debug probes for the RF device.
最新信息
- New device support: CC2745R10Q1, CC2745P10Q1, CC2744R7Q1, CC2745R7Q1, CC2755R10 and CC2755P10 devices
- New SDK support with updated PHY settings: SimpleLink Low Power F3 SDK 8.20.00 and SimpleLink Low Power F3 SDK 8.40.00
- Added packet view that shows all parts of the transmitted packet (for example, preamble, synchronization word, header, payload and CRC)
- Miscellaneous improvements and bug-fixes
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices
SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices
产品
低功耗 2.4GHz 产品
汽车类无线连接产品
硬件开发
评估板
发布信息
The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:
- Bluetooth® Low Energy (BLE) protocol stack
- Zigbee® protocol stack supporting low power wireless mesh networks
- Proprietary RF layer
- TI Drivers
All of the above are provided in one easy-to-use software package along with example applications and documentation.
The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.
This is version 9.10.00.83 of the SimpleLink Low Power F3 SDK.
Supported Features and Limitations
CC23xx
CC27xx
LAES & HSM Limitations
The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.
For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle or will return a NULL handle (AESGCM, ECC, RNG Drivers). If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.
For drivers that support running operations on both hardware accelerators, for primarily AES drivers, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding of each key, part of the input parameters to drivers’ APIs, holes the value of the engine-of-choice.
- To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ or ‘KeyStore_PSA_initKeyHSM(..)’ API and pass in the plaintext key as well as the key length.
- To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.
NOTE:
- Please refer to each driver’s top level header file for driver-specific limitations.
- Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.
- Starting SDK version 9.10, the crypto drivers are removed from the drivers library and moved into a separate secure drivers library: source/ti/drivers/secure/lib.
- Starting SDK version 9.10, if SysConfig generated libraries linker is not used, the secure drivers library will need to be added manually into the respective linker settings.
最新信息
- Bluetooth LE Channel Sounding preview.
- Bluetooth LE Connection Monitor with BLE Stack integration for CC23xx and CC27xx devices.
- Bluetooth LE Power Control Preview for CC23XX and CC27xx devices.
- Bluetooth LE Connection Handover with GATT Layer.
- Certification of devices to be compliant with China MIIT (Ministry of Industry and Information Technology) and the EU RED (European Union Radio Equipment Directive) regulations on 2.4GHz.
- Zigbee Stack Certification - Zigbee Pro 2023 (R23) and Green Power Proxy v1.1.2 (Zigbee Core v1.0.0.0)
设计文件
技术文档
类型 | 标题 | 下载最新的英文版本 | 日期 | |||
---|---|---|---|---|---|---|
证书 | LP-EM-CC2745R10-Q1 EU Declaration of Conformity (DoC) (Rev. A) | 2025年 5月 13日 | ||||
用户指南 | LP-EM-CC2745R10-Q1 EVM User's Guide | PDF | HTML | 2025年 5月 7日 | |||
更多文献资料 | LP-EM-CC2745R10-Q1 Quick Start Guide | 2023年 11月 7日 |