LP-EM-CC2340R53

适用于 CC2340R SimpleLink™ 系列 2.4GHz 多标准无线 MCU 的 LaunchPad™ 开发套件

LP-EM-CC2340R53

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概述

此 LaunchPad™ 开发套件采用 CC2340R53,用于加快 CC2340R SimpleLink™ 系列 2.4GHz 无线 MCU 的开发速度,支持低功耗 Bluetooth®、Thread、Zigbee® 和 2.4GHz 专有协议。由兼容的 SimpleLink™ 低功耗软件开发套件提供软件支持。这是一个分离式 LaunchPad™ 开发套件,意味着不包含 XDS 调试器。推荐使用 LP-XDS110 或 LP-XDS110ET 调试器。

特性
  • 通过 BoosterPack™ 插件模块连接器访问所有 I/O 信号
  • 通过智能手机上的低功耗 Bluetooth® 将 LaunchPad™ 开发套件连接到云
  • 需要单独购买用于软件开发和射频评估的调试器 LP-XDS110ET 或 LP-XDS110

  • 用于调试的电缆(不含调试器)
  • 快速入门指南

低功耗 2.4GHz 产品
CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU
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LP-EM-CC2340R53 — 适用于 CC2340R SimpleLink™ 系列 2.4GHz 多标准无线 MCU 的 LaunchPad™ 开发套件

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SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy

支持的产品和硬件

SIMPLELINK-ACADEMY-CC23XX Simplelink™ CC23xx Academy

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最新版本
版本: 1.00.00.00
发布日期: 03 四月 2023
产品
低功耗 2.4GHz 产品
CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU
汽车类无线连接产品
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU
硬件开发
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LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件 LP-EM-CC2340R53 适用于 CC2340R SimpleLink™ 系列 2.4GHz 多标准无线 MCU 的 LaunchPad™ 开发套件

发布信息

Initial release of CC23xx academy

软件开发套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

支持的产品和硬件
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SIMPLELINK-LOWPOWER-F3-SDK SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

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最新版本
版本: 9.10.00.83
发布日期: 08 五月 2025

校验和

校验和

校验和
download Linux Zip for SimpleLink Low Power F3 SDK  — 524388 K

校验和

校验和
download macOS Zip for SimpleLink Low Power F3 SDK  — 400559 K

校验和
产品
低功耗 2.4GHz 产品
CC2340R2 具有 256kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2340R5 具有 512kB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M0+ 2.4GHz 无线 MCU CC2755R10 具有 1MB 闪存的 SimpleLink™ 32 位 Arm® Cortex®-M33 低功耗 Bluetooth® 无线 MCU
汽车类无线连接产品
CC2340R5-Q1 具有 512kB 闪存、符合汽车标准的 SimpleLink™ 低功耗 Bluetooth® 无线 MCU CC2745P10-Q1 具有 1MB 闪存、HSM、APU、CAN-FD 和 +20dBm 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU CC2745R10-Q1 具有 1MB 闪存、HSM、APU 和 CAN-FD 的汽车级 SimpleLink™ 低功耗 Bluetooth® 6.0 无线 MCU
硬件开发
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LP-EM-CC2340R5 CC2340R5 SimpleLink™ 低功耗 Bluetooth® 5.3 MCU LaunchPad™ 开发套件 LP-EM-CC2340R53 适用于 CC2340R SimpleLink™ 系列 2.4GHz 多标准无线 MCU 的 LaunchPad™ 开发套件 LP-EM-CC2745R10-Q1 CC2745R10-Q1 SimpleLink™ 2.4GHz 无线 MCU LaunchPad™ 开发套件

发布信息

The SimpleLink™ Low Power F3 Software Development Kit (SDK) delivers components that enable engineers to develop applications on the Texas Instruments SimpleLink CC23xx and CC27xx family of wireless microcontrollers (MCUs). This software toolkit provides a cohesive and consistent software experience for all SimpleLink CC23xx and CC27xx wireless MCU users by packaging essential software components, such as:

  • Bluetooth® Low Energy (BLE) protocol stack

  • Zigbee® protocol stack supporting low power wireless mesh networks

  • Proprietary RF layer

  • TI Drivers

All of the above are provided in one easy-to-use software package along with example applications and documentation.

The SimpleLink MCU portfolio offers a single development environment that delivers flexible hardware, software, and tool options for customers developing wired and wireless applications. With 100 percent code reuse across host MCUs, Wi-Fi™, Bluetooth Low Energy, Sub-1GHz devices and more, choose the MCU or connectivity standard that fits your design. A one-time investment with the SimpleLink software development kit allows you to reuse often, opening the door to create unlimited applications. For more information, visit TI SimpleLink Wireless Connectivity.

This is version 9.10.00.83 of the SimpleLink Low Power F3 SDK.

Supported Features and Limitations

CC23xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported AES-ECB Supported AESECB_oneStepDecrypt, AESECB_setupDecrypt not supported AES-GCM Supported AES-CTR Supported AES-CBC Supported AESCBC_oneStepDecrypt, AESCBC_setupDecrypt not supported AES-CTR-DRBG Supported AES-CMAC Supported SHA-256 Supported ECDH Supported ECIES Supported RNG Supported TRNG Not Supported

CC27xx

TI Crypto Driver Overview Support Status Additional Comment AES-CCM Supported HSM AES-ECB Supported HSM AES-GCM Supported HSM AES-CTR Supported HSM AES-CBC Supported HSM AES-CTR-DRBG Not Supported This is supported via RNG AES-CMAC Supported HSM ECDH Supported HSM ECDSA Supported HSM RNG Supported HSM (AES-CTR-DRBG) TRNG Supported HSM

LAES & HSM Limitations

The CC27xx family of devices now include a Hardware Security Module (HSM) for cryptographic and key storage features.

For crypto drivers that support the HSM and LAES, a failure in the HSM bootup process will be cached in the driver’s handle or will return a NULL handle (AESGCM, ECC, RNG Drivers). If the user attempts to perform an HSM operation later, it will return an error due to the cached initialization error. LAES operations would continue to function without issue in that case.

For drivers that support running operations on both hardware accelerators, for primarily AES drivers, a switch has been implemented so that the driver knows which engine to use to execute the operation on. This switch is part of the cryptography operation’s key. The key encoding of each key, part of the input parameters to drivers’ APIs, holes the value of the engine-of-choice.

  • To leverage the HSM hardware accelerator, the user has to call ‘CryptoKeyPlaintextHSM_initKey(..)’ or ‘KeyStore_PSA_initKeyHSM(..)’ API and pass in the plaintext key as well as the key length.

  • To leverage the LAES hardware accelerator, the user has to call ‘CryptoKeyPlaintext_initKey()(..)’ API and pass in the plaintext key as well as the key length.

NOTE:

  • Please refer to each driver’s top level header file for driver-specific limitations.

  • Mass erasing the CC27xx without retaining protected sectors will result in the erasure of the HSM firmware. Please see the Quick Start Guide: Build your first program for the CC23xx or CC27xx device on how to re-flash the HSM firmware.

  • Starting SDK version 9.10, the crypto drivers are removed from the drivers library and moved into a separate secure drivers library: source/ti/drivers/secure/lib.

  • Starting SDK version 9.10, if SysConfig generated libraries linker is not used, the secure drivers library will need to be added manually into the respective linker settings.

最新信息

  • Bluetooth LE Channel Sounding preview.

  • Bluetooth LE Connection Monitor with BLE Stack integration for CC23xx and CC27xx devices.

  • Bluetooth LE Power Control Preview for CC23XX and CC27xx devices.

  • Bluetooth LE Connection Handover with GATT Layer.

  • Certification of devices to be compliant with China MIIT (Ministry of Industry and Information Technology) and the EU RED (European Union Radio Equipment Directive) regulations on 2.4GHz.

  • Zigbee Stack Certification - Zigbee Pro 2023 (R23) and Green Power Proxy v1.1.2 (Zigbee Core v1.0.0.0)

应遵守 TI 的评估模块标准条款与条件.

设计文件

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类型 标题 下载最新的英文版本 日期
EVM 用户指南 LP-EM-CC2340R53 SimpleLink 低功耗蓝牙 5.3 MCU LaunchPad 开发套件 PDF | HTML 英语版 PDF | HTML 2025年 4月 29日
证书 LP-EM-CC2340R53 EU Declaration of Conformity (DoC) (Rev. A) 2025年 3月 24日
证书 LP-EM-CC2340R53 EU Declaration of Conformity (DoC) 2024年 11月 14日

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