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产品详情

Resolution (Bits) 8 Number of DAC channels 1 Interface type Parallel Output type Unbuffered Current Output voltage range (V) 0 to 20 INL (max) (±LSB) 0.5 Settling time (µs) 0.1 Reference type Ext Architecture Multiplying DAC Rating Catalog Sample/update rate (Msps) 10 Power consumption (typ) (mW) 5 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
Resolution (Bits) 8 Number of DAC channels 1 Interface type Parallel Output type Unbuffered Current Output voltage range (V) 0 to 20 INL (max) (±LSB) 0.5 Settling time (µs) 0.1 Reference type Ext Architecture Multiplying DAC Rating Catalog Sample/update rate (Msps) 10 Power consumption (typ) (mW) 5 Operating temperature range (°C) -40 to 85 Product type General-purpose DAC
PDIP (N) 16 181.42 mm² 19.3 x 9.4 PLCC (FN) 20 98.01 mm² 9.9 x 9.9 SOIC (D) 16 59.4 mm² 9.9 x 6 SOP (NS) 16 79.56 mm² 10.2 x 7.8 TSSOP (PW) 16 32 mm² 5 x 6.4
  • Easily Interfaced to Microprocessors
  • On-Chip Data Latches
  • Monotonic Over the Entire A/D Conversion Range
  • Segmented High-Order Bits Ensure Low-Glitch Output
  • Interchangeable With Analog Devices AD7524, PMI PM-7524, and Micro Power Systems MP7524
  • Fast Control Signaling for Digital Signal-Processor Applications Including Interface With TMS320
  • CMOS Technology

All trademarks are the property of their respective owners.

  • Easily Interfaced to Microprocessors
  • On-Chip Data Latches
  • Monotonic Over the Entire A/D Conversion Range
  • Segmented High-Order Bits Ensure Low-Glitch Output
  • Interchangeable With Analog Devices AD7524, PMI PM-7524, and Micro Power Systems MP7524
  • Fast Control Signaling for Digital Signal-Processor Applications Including Interface With TMS320
  • CMOS Technology

All trademarks are the property of their respective owners.

The TLC7524C, TLC7524E, and TLC7524I are CMOS, 8-bit, digital-to-analog converters (DACs) designed for easy interface to most popular microprocessors.

The devices are 8-bit, multiplying DACs with input latches and load cycles similar to the write cycles of a random access memory. Segmenting the high-order bits minimizes glitches during changes in the most significant bits, which produce the highest glitch impulse. The devices provide accuracy to 1/2 LSB without the need for thin-film resistors or laser trimming, while dissipating less than 5 mW typically.

Featuring operation from a 5V to 15V single supply, these devices interface easily to most microprocessor buses or output ports. The 2- or 4-quadrant multiplying makes these devices an ideal choice for many microprocessor-controlled gain-setting and signal-control applications.

The TLC7524C is characterized for operation from 0°C to 70°C. The TLC7524I is characterized for operation from -25°C to 85°C. The TLC7524E is characterized for operation from -40°C to 85°C.

The TLC7524C, TLC7524E, and TLC7524I are CMOS, 8-bit, digital-to-analog converters (DACs) designed for easy interface to most popular microprocessors.

The devices are 8-bit, multiplying DACs with input latches and load cycles similar to the write cycles of a random access memory. Segmenting the high-order bits minimizes glitches during changes in the most significant bits, which produce the highest glitch impulse. The devices provide accuracy to 1/2 LSB without the need for thin-film resistors or laser trimming, while dissipating less than 5 mW typically.

Featuring operation from a 5V to 15V single supply, these devices interface easily to most microprocessor buses or output ports. The 2- or 4-quadrant multiplying makes these devices an ideal choice for many microprocessor-controlled gain-setting and signal-control applications.

The TLC7524C is characterized for operation from 0°C to 70°C. The TLC7524I is characterized for operation from -25°C to 85°C. The TLC7524E is characterized for operation from -40°C to 85°C.

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类型 标题 下载最新的英语版本 日期
* 数据表 8-Bit Multiplying Digital-to-Analog Converters 数据表 (Rev. D) 2007年 6月 13日

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包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

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