产品详情

Bits (#) 1 Data rate (max) (Mbps) 200 Topology Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 2.3 Vin (max) (V) 3.6 Applications GPIO Features Partial power down (Ioff), Vcc isolation Technology family AUP1T Supply current (max) (mA) 0.0036 Rating Catalog Operating temperature range (°C) -40 to 85
Bits (#) 1 Data rate (max) (Mbps) 200 Topology Push-Pull Direction control (typ) Fixed-direction Vin (min) (V) 2.3 Vin (max) (V) 3.6 Applications GPIO Features Partial power down (Ioff), Vcc isolation Technology family AUP1T Supply current (max) (mA) 0.0036 Rating Catalog Operating temperature range (°C) -40 to 85
SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • Single-Supply Voltage Translator
  • Output Level Up to Supply VCC CMOS Level
    • 1.8 V to 3.3 V (at VCC = 3.3 V)
    • 2.5 V to 3.3 V (at VCC = 3.3 V)
    • 1.8 V to 2.5 V (at VCC = 2.5 V)
    • 3.3 V to 2.5 V (at VCC = 2.5 V
  • Schmitt-Trigger Inputs Reject Input Noise and Provide
    Better Output Signal Integrity
  • Ioff Supports Partial Power Down (VCC = 0 V)
  • Very Low Static Power Consumption:
    0.1 µA
  • Very Low Dynamic Power Consumption:
    0.9 µA
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Pb-Free Packages Available: SC-70 (DCK)
    2 × 2.1 × 0.65 mm (Height 1.1 mm)
  • More Gate Options Available at www.ti.com/littlelogic
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

  • Single-Supply Voltage Translator
  • Output Level Up to Supply VCC CMOS Level
    • 1.8 V to 3.3 V (at VCC = 3.3 V)
    • 2.5 V to 3.3 V (at VCC = 3.3 V)
    • 1.8 V to 2.5 V (at VCC = 2.5 V)
    • 3.3 V to 2.5 V (at VCC = 2.5 V
  • Schmitt-Trigger Inputs Reject Input Noise and Provide
    Better Output Signal Integrity
  • Ioff Supports Partial Power Down (VCC = 0 V)
  • Very Low Static Power Consumption:
    0.1 µA
  • Very Low Dynamic Power Consumption:
    0.9 µA
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • Pb-Free Packages Available: SC-70 (DCK)
    2 × 2.1 × 0.65 mm (Height 1.1 mm)
  • More Gate Options Available at www.ti.com/littlelogic
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)

The SN74AUP1T14 performs the Boolean function Y = A with designation for logic-level translation applications with output referenced to supply VCC.

AUP technology is the industry’s lowest-power logic technology designed for use in extending battery-life in operating. All input levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

The wide VCC range of 2.3 V to 3.6 V allows the possibility of switching output level to connect to external controllers or processors.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T14 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

The SN74AUP1T14 performs the Boolean function Y = A with designation for logic-level translation applications with output referenced to supply VCC.

AUP technology is the industry’s lowest-power logic technology designed for use in extending battery-life in operating. All input levels that accept 1.8-V LVCMOS signals, while operating from either a single 3.3-V or 2.5-V VCC supply. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).

The wide VCC range of 2.3 V to 3.6 V allows the possibility of switching output level to connect to external controllers or processors.

Schmitt-trigger inputs (VT = 210 mV between positive and negative input transitions) offer improved noise immunity during switching transitions, which is especially useful on analog mixed-mode designs. Schmitt-trigger inputs reject input noise, ensure integrity of output signals, and allow for slow input signal transition.

Ioff is a feature that allows for powered-down conditions (VCC = 0 V) and is important in portable and mobile applications. When VCC = 0 V, signals in the range from 0 V to 3.6 V can be applied to the inputs and outputs of the device. No damage occurs to the device under these conditions.

The SN74AUP1T14 is designed with optimized current-drive capability of 4 mA to reduce line reflections, overshoot, and undershoot caused by high-drive outputs.

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* 数据表 Low Power, 1.8/2.5/3.3-V In, 3.3-V CMOS Out Single Schmitt-Trigger Inverter Gate 数据表 2010年 4月 16日
应用简报 了解施密特触发器 (Rev. B) PDF | HTML 英语版 (Rev.B) PDF | HTML 2025年 5月 5日
应用手册 原理图检查清单 - 使用自动双向转换器进行设计的指南 PDF | HTML 英语版 PDF | HTML 2024年 12月 3日
应用手册 原理图检查清单 - 使用固定或方向控制转换器进行设计的指南 PDF | HTML 英语版 PDF | HTML 2024年 10月 3日
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选择指南 Voltage Translation Buying Guide (Rev. A) 2021年 4月 15日

设计和开发

如需其他信息或资源,请点击以下任一标题进入详情页面查看(如有)。

评估板

5-8-LOGIC-EVM — 支持 5 至 8 引脚 DCK、DCT、DCU、DRL 和 DBV 封装的通用逻辑评估模块

灵活的 EVM 设计用于支持具有 5 至 8 引脚数且采用 DCK、DCT、DCU、DRL 或 DBV 封装的任何器件。
用户指南: PDF
TI.com 上无现货
参考设计

TIDA-00684 — 高带宽任意波形发生器参考设计:直流或交流耦合高电压输出

TIDA-00684 参考设计开发了一款四通道 TSW3080 评估模块 (EVM),展示了如何使用采用 DAC38J84 的有源放大器接口来演示任意波形发生器前端。DAC38J84 能够以 16 位分辨率和最高可达 2.5GSPS 的更新速率提供四个 DAC 通道。THS3217 可提供宽带差动转单端输出。THS3095 可提供高达 26VP-P 的高动态范围输出。LMH5401 可提供频带较宽的差动输出。所有这些路径都提供了直流耦合接口,能够以高性能水平驱动 50Ω。此设计还包括用于对比目的的参考变压器路径。
设计指南: PDF
原理图: PDF
封装 引脚 CAD 符号、封装和 3D 模型
SOT-SC70 (DCK) 5 Ultra Librarian

订购和质量

包含信息:
  • RoHS
  • REACH
  • 器件标识
  • 引脚镀层/焊球材料
  • MSL 等级/回流焊峰值温度
  • MTBF/时基故障估算
  • 材料成分
  • 鉴定摘要
  • 持续可靠性监测
包含信息:
  • 制造厂地点
  • 封装厂地点

支持和培训

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