The TPSI8830 is an isolated solid-state relay designed for industrial applications. The TPSI8830 uses TI’s high reliability capacitive isolation technology in combination with internal back-to-back MOSFETs to form a completely integrated option requiring no secondary side power supply. The TPSI8830 improves system reliability as TI’s capacitive isolation technology does not suffer from mechanical wear-out or photo degradation failure modes common in mechanical relay and photo relay components.
The primary side of the device is powered by only 5mA of input current and incorporates a fail-safe EN pin preventing any possibility of back powering the VDD supply. In most applications, the VDD pin of the device must connect to a system supply from 3.0V to 5.5V and the EN pin of the device must be driven by a GPIO output with logic HI from 1.8V to 5.5V. In other applications, the VDD and EN pins can be driven together directly from the system supply or from a GPIO output.
The secondary side consists of back-to-back MOSFETs with a standoff voltage of ±80V from S1 to S2. The TPSI8830 integrates bidirectional overcurrent protection to prevent damage due to output miswiring or short to ground.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | TPSI8830 80V, 20mΩ, 4A, Solid-state Relay with Overcurrent Protection, Load Diagnostics and Functional Isolati datasheet | PDF | HTML | May 28, 2026 |
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The TPSI88XXEVM is a hardware evaluation module to evaluate the performance of devices in the TPSI88XX family. Use the TPSI88XXEVM to evaluate application requirements, like thermostats, and PLC digital output modules. The EVM is populated with TPSI8830ZB (DFP package).
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| SSOP (DFJ) | 14 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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