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HZHYT-3P-HZ-CORE-AM62X

HZHYTECH HZ-CORE-AM62x system on module for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

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HZHYT-3P-HZ-CORE-AM62X

来源： HZHYTECH
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概述

The HZ-CORE-AM62X system on module (SOM) is a solder-down "stamp" PCB from HZHYTECH based on AM623 and AM625 processors.

The SOM has low power consumption, low cost and optimal integration, making it widely usable in a variety of applications from high-precision medical measuring instruments, data acquisition processing systems, handheld devices, communication systems, industrial control, and video surveillance and other application fields.

The SOM solder-down form factor features lead-free immersion gold and 10-layer printed board technology to ensure signal integrity and good EMC characteristics. There are 224 pins in total, including 128 half-hole (castellated edge) immersed gold pins and 96 surface-mount pads to expand all interface functions, which is convenient for secondary development and use in production, allowing the user to flexibly configure the functions required by the application.

The TPS6521901RHBR integrated multi-channel power management IC is used to reduce overall system power consumption.

特性
  • 45 mm x 45 mm
  • Solder-down, 128 edge pins, 96 inner-ring pads (224 pins total)
  • 2-GB DDR4, 8-GB eMMC
  • CAN-FD, SPI, RGMII, and PRU/GPMC industrial interfaces available
  • Linux Yocto, Linux-RT, Android (A53); FreeRTOS (M4)
基于 Arm 的处理器
AM623 — 具有基于 Arm® Cortex®-A53 的对象和手势识别功能的物联网 (IoT) 和网关 SoC AM625 — 具有基于 Arm® Cortex®-A53 的边缘 AI 和全高清双显示的人机交互 SoC
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评估板

HZ-CORE-AM62X — HZ-CORE-AM62X core board system on module based on AM623 and AM625 processors

支持的产品和硬件

HZ-CORE-AM62X — HZ-CORE-AM62X core board system on module based on AM623 and AM625 processors

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开发套件

HZ-KIT-AM62X — Development kit for HZ-CORE-AM62X

支持的产品和硬件

HZ-KIT-AM62X — Development kit for HZ-CORE-AM62X

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支持和培训

第三方支持
TI 不会为此硬件提供持续且直接的设计支持。设计期间， 如需获得支持，请联系 HZHYTECH。
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