TI 不会为此硬件提供持续且直接的设计支持。设计期间， 如需获得支持，请联系 Engicam s.r.l.。
ENGCM-3P-ICORE-AM62X
Engicam i.Core-AM62x SO-DIMM system on module for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors
ENGCM-3P-ICORE-AM62X
概述
The new i.Core AM62x system on module is based on the AM623 and AM625 processor device families, and the module is equipped to optimally take advantage of the 1-4 Arm® Cortex®-A53 CPU cores at up to 1.4-GHz and Cortex-M4F MCU co-processor at up to 400MHz. The cost-optimized module will offer up to Full HD (1080p, 60fps) display support and optional 3D graphics acceleration for use in a broad range of open-frame industrial HMI panels. Additionally, the extensive set of peripherals and optimized power architecture create a module well-suited for a broad range of industrial and automotive applications.
特性
- 67.6 mm x 32.1 mm
- SO-DIMM, 200 edge connector pins
- 1-GB or 2-GB DDR4, min. 8-GB eMMC
- 2x USB2.0, 2x on-board Gb Ethernet PHY, I2S audio
- Pin-to-pin compatible with other modules with EDIMM 2.0 pinout definition
- Linux Yocto, Android, CODESYS PROFINET device and controller software stacks
立即订购并开发
评估板
ENGCM-3P-EDIMM-SK — Development kit for i.Core-AM62x SOM
ENGCM-3P-EDIMM-SK — Development kit for i.Core-AM62x SOM
评估板
ENGCM-3P-ICORE-AM62X — i.Core-AM62x system on module based on AM623 and AM625 quad Arm Cortex-A53 1.4-GHz processors
ENGCM-3P-ICORE-AM62X — i.Core-AM62x system on module based on AM623 and AM625 quad Arm Cortex-A53 1.4-GHz processors
支持和培训
视频系列
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