TIDA-070004

Space-grade reference design using integrated digital-output temperature sensor

TIDA-070004

Design files

Overview

This reference design illustrates the fact that several spacecraft projects provide a system health status telemetry that ground personnel monitor in real time. This reference design shows an example using a digital output temperature sensor to acquire temperature data on a sub-system using a radiation hardened MSP430FR5969-SP microcontroller (MCU). This system implements a SPI based slave that responds to a host request for temperature data using a simple register read/write protocol. The reference design includes a TMP461-SP with local temperature sensing and remote diode temperature sensing of an ADC12D1620QML-SP. The board used for this reference design is the TSW12D1620EVM-CVAL. This approach can be used as a starting point for a remote subsystem temperature and health monitor.

Features
  • Local temperature sensing with ±2°C accuracy
  • Remote temperature sensing with ±1.5°C accuracy
  • Ultra-low power radiation hardened MCU
  • I2C temperature sensor output(TMP461-SP)
  • SPI-based slave interface to host
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

TIDUEM2A.PDF (3814 KB)

Reference design overview and verified performance test data

TIDRZ96.PDF (77 KB)

Detailed overview of design layout for component placement

TIDRZ95.PDF (79 KB)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDRZ98.ZIP (2829 KB)

Files used for 3D models or 2D drawings of IC components

TIDCFC8.ZIP (839 KB)

Design file that contains information on physical board layer of design PCB

TIDRZ97.PDF (2629 KB)

PCB layer plot file used for generating PCB design layout

TIDRZ94.PDF (165 KB)

Detailed schematic diagram for design layout and components

Products

Includes TI products in the design and potential alternatives.

High-speed ADCs (≥10 MSPS)

ADC12D1620QML-SPRadiation-hardness-assured (RHA), QMLV, 300-krad, 12-bit, dual 1.6-GSPS or single 3.2-GSPS ADC

Data sheet: PDF | HTML
MSP430 microcontrollers

MSP430FR5969-SPRadiation Hardened Mixed-Signal Microcontroller

Data sheet: PDF | HTML
Digital temperature sensors

TMP461-SPRadiation-hardness-assured (RHA), high-accuracy remote and local temperature sensor

Data sheet: PDF | HTML

Start development

Software

Support software

TIDCFC9 — MSP430FR5969-SP-TempMeasSource

Supported products & hardware

Supported products & hardware

Hardware development
Reference design
TIDA-070004 Space-grade reference design using integrated digital-output temperature sensor
Download options

TIDCFC9 MSP430FR5969-SP-TempMeasSource

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Version: 01.00.00.00
Release date: Mar 9, 2019
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Hardware development
Reference design
TIDA-070004 Space-grade reference design using integrated digital-output temperature sensor

Release Information

The design resource accessed as www.ti.com/lit/zip/tidcfc9 or www.ti.com/lit/xx/tidcfc9/tidcfc9.zip has been migrated to a new user experience at www.ti.com/tool/download/TIDCFC9. Please update any bookmarks accordingly.

Technical documentation

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Type Title Date
* Design guide Space-Grade Temp-Sensing Ref Design Using Integrated Digital-Output (Rev. A) Jul 29, 2019

Related design resources

Hardware development

EVALUATION BOARD
TSW12D1620EVM-CVAL ADC12D1620QML-SP evaluation module for 300-krad, 12-bit, dual 1.6-GSPS or single 3.2-GSPS ADC

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