SDAA059 September   2025 TMCS1123 , TMCS1126 , TMCS1133 , TMCS1143

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
  5. 2Exposure of the SOIC-10 to Board Level Reliability Testing
    1. 2.1 Examination of Solder Joints Through X-ray
    2. 2.2 Thermal Testing
    3. 2.3 Cross Sections
  6. 3Summary
  7. 4References
Application Note

A Comparison of Fused Lead Frame and Non-Fused Lead Frame Variants of Hall Effect Current Sensors