System level cost savings tactics are a focus of this board design. Key areas affecting fabrication costs are number of PCB layers and via drill size. The AM570x features a package with via channel arrays. These channels make it possible to build the PCB in only 6-layers while still achieving 100% signal breakout. The added room helps with signal breakout and routing while avoiding the need for smaller, costlier drill bits for the vias. Another added benefit of larger vias is improved via reliability and electrical performance. This reference design is based on the Texas Instruments Sitara™ AM570x System on Chip. The source documents provided represent a board design that’s been tested for stability and compliance in certain key areas. Those areas are DDR stability, HDMI performance, oscilloscope captures of the power sequencing, and a Power Design Network (PDN) Integrity Analysis.
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Download ready-to-use system files to speed your design process.
Reference design overview and verified performance test data
Detailed overview of design layout for component placement
Complete listing of design components, reference designators, and manufacturers/part numbers
Complete listing of design components, reference designators, and manufacturers/part numbers
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Detailed schematic diagram for design layout and components
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Design guide | AM570x Six-Layer Reference Design | Feb 7, 2018 |
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.