TIDA-050077

4kW, 12V input power path protection reference design using stackable eFuse

TIDA-050077

Design files

Overview

This reference design illustrates a 12V, 4kW input power path protection system for data center servers, using six TPS25985 eFuse devices in parallel. The TPS25985x is a compact, package-integrated, parallelizable, high-current circuit protection and power management device. The primary goal of this reference design is to demonstrate the thermal performance of the TPS25985 eFuse when two devices are positioned in the same area: one at the top and another at the bottom of the PCB. In this configuration, four devices are located on the top layer, while the other two are placed on the bottom layer, directly aligning with the second and third devices on the top layer.

Features
  • Capable of carrying 350ARMS current at an elevated ambient temperature of 55°C without any external airflow
  • 220A and 330A programmable circuit breaker threshold using onboard jumpers
  • LED status for power good and fault indications
  • Options to engage the enable power cycle and the quick output discharge
  • Option to apply custom load transients using onboard metal-oxide semiconductor field-effect transistors (MOSFET), gate-drive circuits and load resistors
  • Option to perform output hot-short using onboard MOSFETs, gate-drive circuits, and five 1mΩ resistors in parallel
  • Monitoring PCB temperature at different locations using onboard analog temperature sensors
Output voltage options TIDA-050077.1
Vin (Min) (V) 10.8
Vin (Max) (V) 13.2
Vout (Nom) (V) 12
Iout (Max) (A) 300
Output Power (W) 3600
Isolated/Non-Isolated Non-Isolated
Input Type DC
Topology Other
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUF75.PDF (3186 KB)

Reference design overview and verified performance test data

TIDME28.PDF (762 KB)

Detailed overview of design layout for component placement

TIDMD26.ZIP (15 KB)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDME30.ZIP (6592 KB)

Files used for 3D models or 2D drawings of IC components

TIDCGX2.ZIP (1572 KB)

Design file that contains information on physical board layer of design PCB

TIDME29.PDF (3234 KB)

PCB layer plot file used for generating PCB design layout

PDF | HTML
TIDME27.PDF (1189 KB)

Detailed schematic diagram for design layout and components

Products

Includes TI products in the design and potential alternatives.

eFuses & hot swap controllers

TPS259854.5-V to 16-V, 0.59-mΩ, 80-A stackable compact eFuse with accurate and fast current monitor

Data sheet: PDF | HTML

Technical documentation

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* Design guide 4kW, 12V Input Power Path Protection Reference Design Using Stackable eFuse PDF | HTML Apr 3, 2025

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