QFN16-DIP-EVM

16-Pin QFN to DIP adapter evaluation module

QFN16-DIP-EVM

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Overview

The QFN16-DIP-EVM provides a fast and easy platform for prototyping TI's RUM16 package parts. This tool is targeted especially for TI's Quad OpAmps, but may be used with any device with the same footprint. Scoring allows each device to be separated into individual circuit boards. With included terminal strips, boards may be plugged into DIP type sockets or solderless breadboards.

Features
  • Low cost
  • Flexible design allows use with any pinout
  • Protoype up to 8 devices with one EVM
  • Compatible with common solderless breadboards

  • QFN16-DIP-EVM Circuit Board
  • (2)Terminal Strip Samtec TS-132-G-AA

Audio op amps
OPA1679 Low distortion (-120 dB), low noise (4.5nV/rtHz), quad audio op amp

 

Precision op amps (Vos<1mV)
OPA4191 Quad, low-power, 36-V, precision, e-trim amplifier with RRIO
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Evaluation board

QFN16-DIP-EVM — 16-Pin QFN to DIP adapter evaluation module

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QFN16-DIP-EVM 16-Pin QFN to DIP adapter evaluation module

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TI's Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

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Type Title Date
* EVM User's guide Using the QFN16-DIP-EVM evaluation module Feb 20, 2019
Certificate QFN16-DIP-EVM EU Declaration of Conformity (DoC) Feb 5, 2019

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