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BDE Technology Inc.
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BDE Technology Inc.

BDE Technology Inc.

Wireless connectivity solution provider

TI preferred partner

BDE Technology was founded in 2009 in Chicago, Illinois. The company specializes in wireless technologies, particularly Wi-Fi, Bluetooth, Bluetooth Low Energy, Zigbee, Thread, Sub-1 GHz, Wi-SUN, Amazon Sidewalk, Matter, RFID and NB-IoT etc. BDE is committed to providing wireless IoT modules and solutions to OEMs, system integrators, device manufacturers and solution providers worldwide. 

BDE is a Texas Instruments (TI) authorized third party module provider. BDE provides across-the-board TI wireless modules. For every TI wireless IC, BDE builds a series of modules around it. Working closely with TI wireless BU, BDE synchronizes the module development progress with that of the chips. The modules are sampled and released to the market at the same time as the ICs.

BDE is a Bluetooth SIG recommended service provider for Prequalified Components, OEM & ODM Products & Reference Designs and Software Application Development.

Equipped with BDE’s innovative products and outstanding services which include wireless modules, HW/SW custom design services, certification services and world class expertise, customers are able to shorten development cycles, reduce design uncertainty, lower market risk, minimize cost, and release more competitive products into markets quickly. BDE`s flexible, highly integrated products and solutions are able to be customized to the most demanding requirements in numerous IoT devices and applications in the fields of industrial automation, medical and health care, automotive, smart energy, smart building, home automation, sports & fitness and consumer electronics etc.
Low-power 2.4-GHz products
CC2340R2 — Bluetooth, Zigbee and Thread wireless MCU with ultra-low standby current, 256kB flash and +8dBm CC2340R5 — Bluetooth, Zigbee and Thread wireless MCU with ultra-low standby current, 512kB flash and +8dBm CC2755P10 — Bluetooth, Zigbee, Thread and Matter wireless MCU with Edge AI NPU, HSM, 1MB flash and +20dBm CC2755R10 — Bluetooth, Zigbee, Thread and Matter wireless MCU with Edge AI NPU, HSM, 1MB flash and +10dBm

 

Sub-1 GHz wireless MCUs
CC1310 — SimpleLink™ 32-bit Arm Cortex-M3 Sub-1 GHz wireless MCU with 128kB Flash CC1311P3 — SimpleLink™ Arm® Cortex®-M4 Sub-1GHz wireless MCU with 352KB flash and integrated +20dBm power amp CC1311R3 — SimpleLink™ Arm® Cortex®-M4 Sub-1 GHz wireless MCU with 352-kB flash CC1312R — SimpleLink™ 32-bit Arm Cortex-M4F Sub-1 GHz wireless MCU with 352kB Flash CC1312R7 — SimpleLink™ Arm® Cortex®-M4F multiprotocol Sub-1 GHz wireless MCU with 704-kB Flash CC1314R10 — SimpleLink™ Arm® Cortex®-M33 Sub-1 GHz wireless MCU with 1-MB flash and up to 296 kB of SRAM CC1352P — SimpleLink™ Arm Cortex-M4F multiprotocol Sub-1 GHz & 2.4 GHz wireless MCU integrated power amplifier CC1352P7 — SimpleLink™ Arm® Cortex®-M4F multiband sub-1GHz & 2.4GHz wireless MCU with EdgeAI support, +20dBm CC1352R — SimpleLink™ Arm Cortex-M4F multiband Sub-1GHz & 2.4GHz wireless MCU with EdgeAI support CC1354P10 — SimpleLink™ Arm® Cortex®-M33 multiband wireless MCU with EdgeAI support, 1MB + 296KB, +20dBm

 

Wi-Fi products
CC2564C — Bluetooth® Dual Mode transceiver qualified against Bluetooth Core 5.1 CC3300 — SimpleLink™ Wi-Fi 6 companion IC CC3301 — SimpleLink™ 2.4GHz Wi-Fi® 6 and Bluetooth® Low Energy companion IC CC3350 — SimpleLink™ dual-band (2.4 and 5 GHz) Wi-Fi 6 companion IC CC3351 — SimpleLink™ dual-band (2.4GHz and 5GHz) Wi-Fi® 6 and Bluetooth® Low Energy companion IC CC3501E — SimpleLink™ wireless MCU with 2.4GHz Wi-Fi® 6 and Bluetooth® Low Energy CC3551E — SimpleLink™ wireless MCU with dual-band (2.4GHz and 5GHz) Wi-Fi® 6 and Bluetooth® Low Energy
BDE Technology Inc. company logo
Contact
Resources offered
  • Daughter card
Supported regions
  • Africa
  • China
  • Europe
  • Japan
  • North America
  • Rest of Asia
Headquarters
  • 67 E Madison St
  • #1603A
  • Chicago, Illinois, 60603
  • United States

Resources

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BDE-3P-BD2564CX — BDE BD2564Cx wireless modules

BDE-3P-BD2564Cx modules are Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) dual-mode transceiver modules based on TI´s CC2564C. These modules deliver best-in-class RF performance with transmit power up to +10dBm and receive sensitivity up to -93dBm. The certified and (...)
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BDE-3P-BDM209B — BDE BDM209B dual-mode Bluetooth® module

BDE-BDM209B is a Bluetooth 5.1 Basic Rate (BR), Enhanced Data Rate (EDR) and Low Energy (LE) Dual-Mode module.

The module offers Bluetooth Classic and Bluetooth LE radio (CC2564C) from Texas Instruments (TI) and an ultra-low-power Arm® Cortex®-M4 32-bit MCU (STM32L431). It integrates all required (...)
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BDE-3P-BW330X — BDE BW330x wireless modules

BDE-3P-BW330x modules are 2.4-GHz Wi-Fi 6 and (Bluetooth® Low Energy Combo) wireless modules based on TI´s CC3301/CC3300. These modules are ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the application throughput requirement is up to 50 Mbps. (...)
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BDE-3P-BW335X — BDE BW335x wireless modules

BDE-3P-BW335x modules are 2.4-GHz & 5-GHz Dual-Band Wi-Fi 6 (and Bluetooth® Low Energy Combo) wireless modules based on TI´s CC3351/CC3350. These modules are ideal for cost-sensitive embedded applications with a Linux or RTOS host running TCP/IP, where the application throughput requirement is (...)
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BDE-3P-BW3501X — TI CC3501E wireless MCU modules

BDE-BW3501 is a 2.4-GHz Wi-Fi® 6 and Bluetooth® LE combo wireless microcontroller (MCU) module series based on TI’s SimpleLink™ Wi-Fi System-on-Chip CC3501. This module series is ideal for cost-sensitive embedded applications with RTOS software, where the peak application throughput requirement is (...)
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BDE-3P-BW3551X — TI CC3551E wireless MCU modules

BDE-BW3551 is a 2.4-GHz & 5-GHz dual-band Wi-Fi® 6 and Bluetooth® LE combo wireless MCU module series based on TI’s SimpleLink™ Wi-Fi System-on-Chip CC3551. This module series is ideal for cost-sensitive embedded applications with RTOS software, where the peak application throughput requirement is (...)
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BDE-3P-CC2755P10-MODULES — BDE CC2755P10 modules with PCB antenna, UFL connector, RF PIN and 105°C working temp

BDE-MP2755P10 is a series of compact, cost-effective 2.4GHz multiprotocol wireless MCU modules powered by TI’s CC2755P10 single-chip MCU. Featuring an Arm Cortex-M33 processor and a qualified Bluetooth® 6.0 stack, it operates as a standalone unit without requiring an external MCU. It supports (...)
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BDE-3P-CC2755P20-MODULES — BDE CC2755P20 modules with PCB antenna, UFL connector, RF PIN, 105°C working temp

The BDE-MP2755P20 series are high-performance 2.4GHz multiprotocol wireless MCU modules powered by TI’s CC2755P20 single-chip solution. Featuring an Arm Cortex-M33 processor and a fully qualified Bluetooth® 6.0 stack, they operate independently without an external MCU. With 2MB of on-chip flash, (...)
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BDE-3P-CC2755R10-MODULES — BDE CC2755R10 modules with PCB antenna, UFL connector, RF PIN and 105°C working temp

The BDE-MP2755R10 series are compact, cost-effective 2.4GHz multiprotocol wireless MCU modules powered by TI’s CC2755R10 single-chip MCU. Featuring an Arm Cortex-M33 processor and a qualified Bluetooth® 6.0 stack, they operate as standalone units without requiring an external MCU. They support (...)
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BDE-3P-LE2340 — BDE LE2340 wireless modules

BDE-3P-LE2340 modules are Bluetooth® 5.3 Low Energy wireless modules based on the CC2340R. With their low cost and exceptional RF and power consumption performance, these modules are ideal for applications that are cost-sensitive and require extended battery life. Multiple variants are available to (...)
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BDE-3P-SUB1GHZ — BDE sub-1GHz modules

BDE Technology, Inc. is a TI-certified third-party module provider. Based on TI's CC1XXX sub-1GHz wireless connectivity products, BDE's modules allow customers to shorten development cycles, reduce design uncertainty, lower product cost and release efficiently launch competitive products. BDE (...)
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