Package optimization – HotRod™ and Enhanced HotRod QFN™

Watch this short video to learn about the benefits of our HotRod (Flip-Chip) packages can bring to your systems that require Low EMI performance.

00:04:53|03 Mar 2021
HotRod, or flip-chip on leadframe QFN packages, eliminate the need for bondwires. See how you can use our HotRod package technology in an appropriate layout to mitigate EMI issues, while additional HotRod enhancements like thermal pads can also reduce your solution size. 

This video is part of a series