Expanding our back-end manufacturing to support customer growth
Recent news
TI opens second assembly and test factory in Melaka, Malaysia
November 6, 2025 – This new factory, which is already in production, reinforces TI's strategy to control its manufacturing operations and deliver reliable capacity. The site will assemble and test billions of chips annually, strengthening the company's global supply chain.
What happens at an assembly and test site
Processed wafers are shipped from a TI wafer fab to one of our A/T sites, located around the world. Each wafer is packed with up to millions of semiconductor chips. At the A/T site, the individual chips are separated from the wafer, assembled, packaged and rigorously tested to ensure they meet quality and industry standards.
Our internal assembly and test capabilities, combined with our in-house research and development expertise across product design and packaging technology development, enable us to innovate at scale.
What sets us apart
Expanding capacity
We’re expanding back-end manufacturing capacity and will internally own more than 90% of assembly and test capacity by 2030, giving us greater control over our supply chain.
Innovation through integration
By owning the entire process from chip design through final testing, we can innovate across our portfolio to provide our customers with thousands of product, packaging and configuration options.
Assuring supply in a global market
As semiconductor demand grows, our investments in back-end manufacturing allows us to produce nearly all of our manufacturing flows and technologies at more than one site, ensuring reliable supply in an ever-changing global landscape.
An inside look
Explore one of our assembly and test sites – commonly known as "back-end manufacturing" where we package, assemble and test tens of millions of analog and embedded processing chips daily.
Click through the image to learn about where semiconductor wafers are
Wafer probing
The probe process conducts electrical tests on individual chips to test for functionality and performance so that only the good dies proceed to packaging. This results in reduced waste and improved yield.
Learn how back-end manufacturing helps build capacity for decades to comeWafer bumping
Bumping is a wafer-level packaging process where tiny solder bumps or copper pillars are formed on the die pads. The bumps replace wire bonds and serve as electrical, mechanical and thermal connections between chips and the package substrate, enabling high-density, high-performance packaging.
Learn how back-end manufacturing helps build capacity for decades to comeFront of line
The front of the line covers the initial assembly steps such as wafer saw, die attach, wire bonding and molding. These are the processes that build the mechanical and electrical foundations of the package.
Learn how back-end manufacturing helps build capacity for decades to comeEnd of line
The end of the line includes laser marking, trim and form, and plating/singulation, which prepare the package for identification and printed circuit board (PCB) assembly. Laser marking engraves identification on the package surface, while trim and form cut and shape the leads for PCB assembly.
Learn how back-end manufacturing helps build capacity for decades to comeTest
The final test includes an inspection that verifies the electrical performance and reliability of each device. This stage is followed by shipment of the qualified products to customers.
Learn how back-end manufacturing helps build capacity for decades to come