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  • TMP110 Ultra-Small, ±1.0°C Accurate, I2C Digital Temperature Sensor for Cost-Sensitive Systems

    • SNIS233A February   2024  – July 2024 TMP110

      PRODUCTION DATA  

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  • TMP110 Ultra-Small, ±1.0°C Accurate, I2C Digital Temperature Sensor for Cost-Sensitive Systems
  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Related Products
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Temperature Output
      2. 7.3.2 Decoding Temperature Data
      3. 7.3.3 Temperature Limits and Alert
    4. 7.4 Device Functional Modes
      1. 7.4.1 Continuous-Conversion Mode
      2. 7.4.2 One-Shot Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
      2. 7.5.2 Bus Overview
      3. 7.5.3 Device Address
      4. 7.5.4 Bus Transactions
        1. 7.5.4.1 Writes
        2. 7.5.4.2 Reads
        3. 7.5.4.3 General Call Reset Function
        4. 7.5.4.4 SMBus Alert Response
        5. 7.5.4.5 Time-Out Function
        6. 7.5.4.6 Coexist on I3C Mixed Bus
  9. 8 Register Map
    1. 8.1 Temp_Result Register (address = 00h) [reset = xxxxh]
    2. 8.2 Configuration Register (address = 01h) [reset = 60A0h]
    3. 8.3 TLow_Limit Register (address = 02h) [reset = 4B00h]
    4. 8.4 THigh_Limit Register (address = 03h) [reset = 5000h]
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Equal I2C Pullup and Supply Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
      4. 9.2.4 Power Supply Recommendations
    3. 9.3 Layout
      1. 9.3.1 Layout Guidelines
      2. 9.3.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information
  14. IMPORTANT NOTICE

Package Options

Mechanical Data (Package|Pins)
  • DPW|5
    • MPSS088
Thermal pad, mechanical data (Package|Pins)
  • DPW|5
    • QFND704B
Orderable Information
  • snis233a_oa
  • snis233a_pm
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  • Full reading width
    • Full reading width
    • Comfortable reading width
    • Expanded reading width
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Data Sheet

TMP110 Ultra-Small, ±1.0°C Accurate, I2C Digital Temperature Sensor for Cost-Sensitive Systems

1 Features

  • Ultra-small, leadless X2SON-5 package
    • Package size: 0.8 × 0.8 × 0.4mm
  • Wide operating ranges
    • V+ operating range: 1.14V to 5.5V
    • Temperature range: -40°C to 125°C
  • Accuracy holds across temperature
    • ±1.0°C (maximum) from -40°C to 125°C
  • 12-bit resolution: 0.0625°C (LSB)
  • Flexible digital interface
    • I2C and SMBus compatible
    • I3C Mixed Bus co-existence capable
  • Pinout and software compatible upgrades
    • ±0.5°C → TMP112 (X2SON package)
  • Low supply current
    • 55μA Active current (typical)
    • 0.15μA Shutdown current (typical)
    • 3.2μA Average current (typical) at 1Hz
  • Software compatible with Industry-Standard
    • TMP102, TMP112
  • Two (2) pinout options available
    • ALERT Pin: TMP110D0, TMP110D1, TMP110D2, TMP110D3
    • Address Pin: TMP110D

  • GUI-Based C-Code Generator

2 Applications

  • Building automation
    • Occupancy detection
    • Video doorbell
    • HVAC: Wireless environmental sensor
  • Factory automation & control
    • Machine vision camera
    • Industrial PC: Single board computer
    • CPU (PLC controller)
  • Cold chain
  • Data center & enterprise computing
    • Solid state drive (SSD)
    • Rack Server Motherboard
  • Personal electronics
    • PC & notebooks, tablets
    • Digital still & video camera
    • Augmented reality glasses
    • Smart speakers

3 Description

The TMP110 is a I2C-compatible digital temperature sensor in an ultra-small (0.64mm2) 5-pin package. The small size and height package optimizes volume constrained systems where DSBGA packages can be considered unsuitable. Unlike DSBGA packages of comparable size, TMP110 provides a 5th pin that can either be used as an address pin or alert pin, providing flexibility for both scalability of number of sensors or monitoring critical thermal events.

The TMP110 offers an accuracy of ±1.0°C across the temperature range with an on-chip 12-bit analog-to-digital converter (ADC) that provides a temperature resolution of 0.0625°C.

The TMP110 is designed to operate from a supply range as low as 1.14V, with a low average and shutdown current of 3.2µA (at 1Hz) and 0.15µA, respectively, allowing for an on-demand temperature conversion and maximizing of battery life. The supply can also be raised to as high as 5.5V for a range of industrial applications.

Package Information
PART NUMBERPACKAGE1PACKAGE SIZE2
TMP110X2SON (5)0.8mm × 0.8mm
(1) For more information, see Section 12.
(2) The package size (length × width) is a nominal value and includes pins, where applicable.
TMP110 Simplified Schematic Figure 3-1 Simplified Schematic

4 Related Products

Pin-to-pin and software compatible options are available.

Table 4-1 Related Temperature Sensors
DEVICEBEST ACCURACY (MAXIMUM)SOFTWARE COMPATIBLEADDRESS/ALERT PIN FUNCTIONALITYPACKAGE OPTIONS
TMP1022.0 °CYesAddress + AlertDRL (6-pin SOT563)
(1.6mm × 1.6mm)
TMP1101.0 °CYesSeparate (Address & Alert)DPW (5-pin X2SON)
(0.8mm × 0.8mm)
TMP1120.5 °CYesAddress + Alert (DRL)DRL (6-pin SOT563)
(1.6mm × 1.6mm)
Separate (Address & Alert) (DPW)DPW (5-pin X2SON)
(0.8mm × 0.8mm)

5 Pin Configuration and Functions

Figure 5-1 DPW Package
5-Pin X2SON
Address variant
(Top View)
Figure 5-2 DPW Package
5-Pin X2SON
Alert variant
(Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.NO.
GND11—Ground
Pin-1 has curved edges.
SCL22ISerial clock
ADD0

(TMP110D)

3—IAddress select. Connect to GND, SCL, SDA or V+.
Only for Address variant.
ALERT

(TMP110D0, TMP110D1,
TMP110D2, TMP110D3)

—3OOvertemperature alert(2). Open-drain output; requires a pullup resistor.
Only for Alert variant.
Note: Connecting to GND if Alert pin is not used is preferred.
SDA44I/OSerial data input. Open-drain output; requires a pullup resistor.
V+55ISupply voltage
(1) I = Input, O = Output, I/O = Input or Output.
(2) For more information see Section 7.3.3

6 Specifications

6.1 Absolute Maximum Ratings

Over free-air temperature range unless otherwise noted(1)
MIN MAX UNIT
Supply voltage V+ –0.3 6 V
Input/Output voltage SCL, SDA, ADD0, ALERT –0.3 6 V
Output current ±10 mA
Operating temperature, TA –40 125 °C
Junction temperature, TJ 150 °C
Storage temperature, Tstg –55 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
V+ Supply voltage 1.14 3.3 5.5 V
VI/O SCL, SDA, ADD0, ALERT 0 5.5 V
IOL SDA, ALERT 0 3 mA
TA Operating ambient temperature -40 125 °C

6.4 Thermal Information

THERMAL METRIC(1) TMP110 UNIT
DPW
5-pins
RθJA Junction-to-ambient thermal resistance 230 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 194 °C/W
RθJB Junction-to-board thermal resistance 158.4 °C/W
ΨJT Junction-to-top characterization parameter 20 °C/W
ΨJB Junction-to-board characterization parameter 158.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 108.4 °C/W
MT Thermal Mass 0.46 mJ/°C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.

6.5 Electrical Characteristics

Over free-air temperature range and V+ = 1.14V to 5.5V (unless otherwise noted); Typical specifications are at TA = 25°C and V+ = 3.3V (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE SENSOR
TERR Accuracy (temperature error) -40°C to 125°C 1.14V ≤ V+ ≤ 1.4V ± 2.0 °C
1.4V < V+ ≤ 5.5V ± 1.0 °C
PSR DC power supply rejection  V+ ≥ 1.4V 0.02 °C/V
TRES Temperature resolution 12 Bits
62.5 m°C
TREPEAT Repeatability(1) V+ = 3.3V
3 sigma distribution		 ±1 LSB
TLTD Long-term stability and drift 1000 hours at 125°C(2) ±1 LSB
tRESP_L Response time (Stirred Liquid) 2-layer FR4 PCB 1.5748 mm thickness τ = 63% for step response from 25°C to 75°C 1.45 s
THYST Temperature cycling and hysteresis(3) 0.0625 °C
tACT Active conversion time V+ ≥ 1.4V 10.25 11.25 ms
V+ < 1.4V 10.5 12
tVAR Timing variation of all device settings V+ ≥ 1.4V -10 10 %
V+ < 1.4V -15  15
DIGITAL INPUT/OUTPUT
CIN Input capacitance 3 pF
VIH Input logic high V+ < 1.4V 0.8 × V+ V
1.4V ≤ V+ 0.7 × V+ V
VIL Input logic low V+ < 1.4V -0.3 0.2 × V+ V
1.4V ≤ V+ -0.3 0.3 × V+ V
VHYST Hysteresis 0.1 V
IIN Input current ± 0.1 μA
VOL Output logic V+ ≥ 1.4V IOL = –3mA 0.13 0.4 V
V+ < 1.4V IOL = –0.75mA 0.2 V
POWER SUPPLY
IDD_ACTIVE Supply current during active conversion Active Conversion, serial bus idle 55 90 μA
IDD_AVG Average current consumption Continous conversion mode
1Hz conversion period		 Serial bus idle 3.2 μA
SCL = 1MHz 13.5
IDD_SB Standby current(4) Continous conversion mode
Serial bus idle		 2.6 5 μA

IDD_SD
 		 Shutdown current TA = +25°C, Serial bus inactive 0.15 0.35 μA
TA = -40°C to 125°C 1.5
Serial bus active, SCL frequency = 400kHz 5.5
Serial bus active, SCL frequency = 1MHz 13
VPOR Power-on reset threshold voltage Supply rising 1.02 1.06 V
Brownout detect Supply falling 0.94 0.97 V
tINIT Power-on reset time 0.5 ms
tRESET Reset Time General Call Reset 0.1 ms
(1) Repeatability is the ability to reproduce a reading when the measured temperature is applied consecutively, under the same conditions.
(2) Long term stability is determined using accelerated operational life testing at a junction temperature of 150°C.
(3) Hysteresis is defined as the ability to reproduce a temperature reading as the temperature varies from room → hot →room→cold→room. The temperatures used for this test are -40°C, 25°C, and 125°C.
(4) Quiescent current between periods

6.6 I2C Interface Timing

minimum and maximum specifications are over –40°C to 125°C and V+ = 1.14V to 5.5V (unless otherwise noted)(1)
FAST MODE FAST MODE PLUS UNIT
MIN MAX MIN MAX
f(SCL) SCL operating frequency 1 400 1 1000 kHz
t(BUF) Bus-free time between STOP and START conditions 0.6 0.5 µs
t(SUSTA) Repeated START condition setup time 0.6 0.26 µs
t(HDSTA) Hold time after repeated START condition.
After this period, the first clock is generated.		 0.6 0.26 µs
t(SUSTO) STOP condition setup time 0.6 0.26 µs
t(HDDAT) Data hold time(2) 100 900 12 150 ns
t(SUDAT) Data setup time 100 50 ns
t(LOW) SCL clock low period 1.3 0.5 µs
t(HIGH) SCL clock high period 0.6 0.26 µs
t(VDAT) Data valid time (data response time)(3) 0.9 0.45 µs
tR SDA, SCL rise time 300 120 ns
tF SDA, SCL fall time 300 20 x
(V+ / 5.5V)		 120 ns
ttimeout Timeout (SCL = GND or SDA = GND) 30 30 ms
tLPF Glitch suppression filter 50 50 ns
(1) The controller and device have the same V+ value. Values are based on statistical analysis of samples tested during initial release.
(2) The maximum t(HDDAT) can be 0.9µs for fast mode, and is less than the maximum t(VDAT) by a transition time.
(3) t(VDAT) = time for data signal from SCL LOW to SDA output (HIGH to LOW, depending on which is worse). 

 
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