SNAS889
March 2026
LMK6B
ADVANCE INFORMATION
1
1
Features
2
Applications
3
Description
4
Device Comparison
5
Pin Configuration and Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Environmental Compliance
6.4
Recommended Operating Conditions
6.5
Thermal Information
6.6
Electrical Characteristics
6.7
Timing Diagrams
6.8
Typical Characteristics
7
Parameter Measurement Information
7.1
Device Output Configurations
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Features Description
8.3.1
Bulk Acoustic Wave (BAW)
8.3.2
Device Block-Level Description
8.3.3
Function Pins
8.3.4
Output Terminations
8.4
Device Functional Modes
9
Application and Implementation
9.1
Application Information
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Clocking TI Clock Buffers with the LMK6Bx
9.2.4
Application Curves
9.2.4.1
LVDS Phase Noise Curves
9.2.4.2
AC-LVPECL Phase Noise Curves
9.2.4.3
LP-HCSL Phase Noise Curves
9.3
Replacing Competitor Oscillators with the LMK6Bx
9.3.1
Replacing a LVPECL oscillator with the LMK6Bx
9.3.2
Replacing a HCSL OSC With the LMK6Bx
9.4
Power Supply Recommendations
9.5
Layout
9.5.1
Layout Guidelines
9.5.1.1
Providing Thermal Reliability
9.5.1.2
Recommended Solder Reflow Profile
9.5.2
Layout Example
10
Device and Documentation Support
10.1
Documentation Support
10.1.1
Related Documentation
10.2
Receiving Notification of Documentation Updates
10.3
Support Resources
10.4
Trademarks
10.5
Electrostatic Discharge Caution
10.6
Glossary
11
Revision History
12
Mechanical, Packaging, and Orderable Information
12.1
Mechanical Data
12.2
Tape and Reel Information
Package Options
Mechanical Data (Package|Pins)
DLR|6
MPSS227
Thermal pad, mechanical data (Package|Pins)
Data Sheet
LMK6B 9.3fs Ultra-Low Jitter, High-performance Differential Oscillator