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  • TMS320F2802x, TMS320F2802xx MCUs Silicon Revisions B, A, 0

    • SPRZ292S December   2008  – November 2020 TMS320F28020 , TMS320F280200 , TMS320F28021 , TMS320F28022 , TMS320F28022-Q1 , TMS320F280220 , TMS320F28023 , TMS320F28023-Q1 , TMS320F280230 , TMS320F28026 , TMS320F28026-Q1 , TMS320F28026F , TMS320F28027 , TMS320F28027-Q1 , TMS320F280270 , TMS320F28027F , TMS320F28027F-Q1

       

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  • TMS320F2802x, TMS320F2802xx MCUs Silicon Revisions B, A, 0
  1.   TMS320F2802x, TMS320F2802xx MCUs Silicon Revisions B, A, 0
  2. 1Introduction
  3. 2Device and Development Support Tool Nomenclature
  4. 3Device Markings
  5. 4Usage Notes and Known Design Exceptions to Functional Specifications
    1. 4.1 Usage Notes
      1. 4.1.1 PIE: Spurious Nested Interrupt After Back-to-Back PIEACK Write and Manual CPU Interrupt Mask Clear Usage Note
      2. 4.1.2 Flash: MAX "Program Time” and “Erase Time” in Revision O of the TMS320F2802x Microcontrollers Data Manual are only Applicable for Devices Manufactured After October 2020
    2. 4.2 Known Design Exceptions to Functional Specifications
      1.      Advisory to Silicon Variant / Revision Map
      2.      Advisory
      3.      Advisory
      4.      Advisory
      5.      Advisory
      6.      Advisory
      7.      Advisory
      8.      Advisory
      9.      Advisory
      10.      Advisory
      11.      Advisory
      12.      Advisory
      13.      Advisory
      14.      Advisory
      15.      Advisory
      16.      Advisory
      17.      Advisory
      18.      Advisory
      19.      Advisory
      20.      Advisory
      21.      Advisory
      22.      Advisory
  6. 5Documentation Support
  7. 6Trademarks
  8. 7Revision History
  9. IMPORTANT NOTICE
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ERRATA

TMS320F2802x, TMS320F2802xx MCUs Silicon Revisions B, A, 0

TMS320F2802x, TMS320F2802xx MCUs Silicon Revisions B, A, 0

1 Introduction

This document describes the silicon updates to the functional specifications for the TMS320F2802x and TMS320F2802xx microcontrollers (MCUs).

The updates are applicable to:

  • 38-pin Thin Shrink Small-Outline Package, DA Suffix
  • 48-pin Low-Profile Quad Flatpack, PT Suffix

2 Device and Development Support Tool Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all [TMS320] DSP devices and support tools. Each TMS320™ DSP commercial family member has one of three prefixes: TMX, TMP, or TMS (for example, TMS320F28027). Texas Instruments recommends two of three possible prefix designators for its support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).

TMXExperimental device that is not necessarily representative of the final device's electrical specifications
TMPFinal silicon die that conforms to the device's electrical specifications but has not completed quality and reliability verification
TMSFully qualified production device

Support tool development evolutionary flow:

TMDXDevelopment-support product that has not yet completed Texas Instruments internal qualification testing
TMDSFully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."

TMS devices and TMDS development-support tools have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard production devices. Texas Instruments recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TI device nomenclature also includes a suffix with the device family name. This suffix indicates the package type (for example, DA) and temperature range (for example, T).

3 Device Markings

Figure 3-1 and Figure 3-2 provide examples of the 2802x device markings and define each of the markings. The silicon revision can be determined by the symbols marked on the top of the package as shown in Figure 3-1 and Figure 3-2 (see Table 3-1). Some prototype devices may have markings different from those illustrated. Figure 3-3 and Figure 3-4 show the device nomenclature.

GUID-B2265050-BE11-4311-982B-AC42EBDFFF81-low.gifFigure 3-1 Examples of 2802x Device Markings on PT Package
GUID-A9F9C837-60E6-4320-9927-629154B45F54-low.gifFigure 3-2 Example of 2802x Device Markings on DA Package
Table 3-1 Determining Silicon Revision From Lot Trace Code (2802x and 2802xx Devices)
PACKAGE MARKING CODE(1)SILICON REVISIONREVISION ID
Address: 0x0883
COMMENTS
BlankIndicates Revision 00x0000This silicon revision is available as TMP and TMS.
AIndicates Revision A0x0001This silicon revision is available as TMS.
BIndicates Revision B0x0002This silicon revision is available as TMS.
(1) TMS320F2802xF devices are only available in revision B silicon. All other devices are only available in revision A silicon.
GUID-F088303F-8502-409C-AC50-D715EA6C75CD-low.gif
For more information on peripheral, temperature, and package availability for a specific device, see the TMS320F2802x Microcontrollers Data Manual.
Figure 3-3 Device Nomenclature for 2802x and 280200
GUID-BB8812B8-EE07-49F1-A714-27463055850D-low.gif
For more information on peripheral, temperature, and package availability for a specific device, see the TMS320F2802x0 Microcontrollers Data Manual.
Figure 3-4 Device Nomenclature for 2802x0

 

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