SPRAD05D
August 2024 – June 2025
AM620-Q1
,
AM623
,
AM625
,
AM625-Q1
,
AM625SIP
1
Abstract
Trademarks
1
Introduction
1.1
Before Getting Started With the Custom Board Design
1.2
Peripheral Circuit Implementation - Compatibility Between Processor Families
1.3
Selection of Required Processor OPN (Orderable Part Number)
1.3.1
Note on AM625SIP Processor Data Sheet
1.3.2
AM625 and AM625SIP Custom Boards, Design Compatibility
1.4
Technical Documentation
1.4.1
Updated SK Schematic With Design, Review and Cad Notes Added
1.4.2
Collaterals on TI.com, Processor Product Page
1.4.3
Updates to Hardware Design Considerations User's Guide
1.4.4
Processor and Peripherals Related FAQs to Support Custom Board Designs
1.5
Custom Board Design Documentation
1.6
Processor and Processor Peripherals Design Related Queries During Custom Board Design
2
Custom Board Design Block Diagram
2.1
Developing the Custom Board Design Block Diagram
2.2
Configuring the Boot Mode
2.3
Configuring the Processor Pins Functionality (PinMux Configuration)
3
Power Supply
3.1
Power Supply Architecture
3.1.1
Integrated Power Architecture
3.1.2
Discrete Power Architecture
3.2
Processor Supply (Power) Rails (Operating Voltage)
3.2.1
Supported Low-Power Modes
3.2.2
Core Power Supply
3.2.3
Peripherals Power Supply
3.2.4
DDR PHY and SDRAM Power Supply
3.2.4.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
3.2.4.2
AM625SIP
3.2.5
Dual-Voltage IO Supply for IO Group (Processor) Power Supply
3.2.6
Dynamic Voltage Switching Dual-Voltage Power Supply
3.2.7
VPP (eFuse ROM Programming) Power Supply
3.2.8
Internal LDOs for IO Supply for IO Groups (Processor)
3.3
Power Supply Filtering
3.4
Power Supply Decoupling and Bulk Capacitors
3.4.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
3.4.2
AM625SIP
3.4.3
Note on PDN Target Impedance
3.5
Power Supply Sequencing
3.6
Power Supply Diagnostics (Using Processor Supported External Input Voltage Monitors)
3.7
Power Supply Diagnostics (Monitoring Using External Monitoring Circuit (Devices))
3.8
Custom Board Current Requirements Estimation and Supply Sizing
4
Processor Clock (Input and Output)
4.1
Processor Clocking (External Crystal or Oscillator)
4.1.1
WKUP_LFOSC0 Connection When Unused
4.1.2
MCU_OSC0 and WKUP_LFOSC0, Crystal Selection
4.1.3
LVCMOS Compatible Digital Clock Input Source
4.2
Processor Clock Outputs
4.2.1
Observation Clock Outputs
4.3
Clock Tree Tool
5
JTAG (Joint Test Action Group)
5.1
JTAG / Emulation
5.1.1
Configuration of JTAG / Emulation
5.1.1.1
BSDL File
5.1.2
Implementation of JTAG / Emulation
5.1.3
Connection Recommendations for JTAG Interface Signals
5.1.4
Debug Boot Modes and Boundary Scan Compliance
6
Configuration (Processor) and Initialization (Processor and Device)
6.1
Processor Reset
6.2
Latching of Processor Boot Mode Configuration Inputs
6.3
Resetting of the Attached Devices
6.4
Watchdog Timer
7
Processor - Peripherals Connection
7.1
Selecting Peripherals Across Domains
7.2
Memory Controller (DDRSS)
7.2.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
7.2.1.1
Processor DDR Subsystem and Device Register Configuration
7.2.1.2
Calibration Resistor Connection for DDRSS
7.2.1.3
DDRSS Signals Pin (Package) Delay Information
7.2.1.4
Attached Memory Device ZQ and Reset_N (Memory Device Reset) Connection
7.2.2
AM625SIP
7.2.2.1
AMK Package Reassigned DDRSS Pins
7.2.2.2
DDRSS and Memory Device Calibration Resistor Connection
7.2.2.3
LPDDR4 (Internal) Memory Calibration Resistor Connection
7.3
Media and Data Storage Interfaces (MMC0, MMC1, MMC2, OSPI0/QSPI0 and GPMC0)
7.4
Ethernet Interface
7.4.1
Common Platform Ethernet Switch 3-port Gigabit (CPSW3G0)
7.5
Programmable Real-Time Unit Subsystem (PRUSS)
7.6
Universal Serial Bus (USB) Subsystem
7.7
General Connectivity Peripherals
7.7.1
Inter-Integrated Circuit (I2C) Interface
7.8
Display Subsystem (DSS)
7.8.1
AM625 / AM623 / AM625-Q1 / AM625SIP
7.8.2
AM620-Q1
7.9
Camera Interface
7.10
Connection of Processor Power Supply Pins, IOs and Peripherals When not Used
7.10.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
7.10.2
AM625SIP
7.10.3
External Interrupt (EXTINTn)
7.10.4
RSVD Reserved Pins (Signals)
8
Interfacing of Processor IOs (LVCMOS or SDIO or Open-Drain, Fail-Safe Type IO Buffers) and Performing Simulations
8.1
IBIS Model
8.2
IBIS-AMI Model
9
Processor Current and Thermal Analysis
9.1
Power Estimation
9.2
Maximum Current Rating for Different Supply Rails
9.3
Supported Power Modes
9.4
Thermal Design Guidelines
9.4.1
Thermal Model
9.4.2
Voltage Thermal Management Module (VTM)
10
Schematic:- Capture, Entry and Review
10.1
Custom Board Design Passive Components and Values Selection
10.2
Custom Board Design Electronic Computer Aided Design (ECAD) Tools Considerations
10.3
Custom Board Design Schematic Capture
10.4
Custom Board Design Schematic Review
11
Floor Planning, Layout, Routing Guidelines, Board Layers and Simulation
11.1
Escape Routing for PCB Design
11.2
DDR Design and Layout Guidelines
11.2.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
11.2.2
AM625SIP
11.3
High-Speed Differential Signal Routing Guidelines
11.4
Processor-Specific SK Board Layout
11.5
Custom Board Layer Count and Layer Stack-up
11.5.1
AM625 / AM623 / AM620-Q1 / AM625-Q1
11.5.2
AM625SIP
11.5.3
Simulation Recommendations
11.6
DDR-MARGIN-FW
11.7
Reference for Steps to be Followed for Running Board Simulation
12
Custom Board Assembly and Testing
12.1
Custom Board Bring-up Tips and Debug Guidelines
13
Processor (Device) Handling and Assembly
13.1
Processor (Device) Soldering Recommendations
13.1.1
Additional References
14
References
14.1
AM625SIP
14.2
AM625 / AM623
14.3
AM620-Q1 / AM625-Q1
14.4
AM625 / AM623 / AM620-Q1 / AM625-Q1
14.5
Common for all AM62x family of processors
15
Terminology
16
Revision History
User's Guide
Hardware Design Considerations for Custom Board Design Using AM625, AM623, AM620-Q1, AM625-Q1, AM625SIP Processor Family