SNAA408
April 2025
LMK3H0102
1
Abstract
Trademarks
1
Introduction
2
Output Recommendations
2.1
Differential vs. Single-Ended
2.2
Slew Rate
2.3
Spread Spectrum Clocking
3
PCB Design
3.1
Stackup
3.2
Power Filtering
3.3
Avoid Bottlenecking
3.4
Strategic Via Placements
3.4.1
Distributing Power Concentrations
3.4.1.1
Via Sizes
3.4.1.2
Pads and Pours
3.4.2
Shielding and Stitching Vias
4
Minimize Possible Antennas
4.1
Stubs
4.2
Net Pours
5
Summary
6
References
Application Note
EMI Reduction Strategies With Clocking Devices