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  • High Side Switch Motherboard Evaluation Module

    • SLVUBD4B January   2018  – October 2020 TPS27SA08

       

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  • High Side Switch Motherboard Evaluation Module
  1.   Trademarks
  2. 1Introduction
    1. 1.1 Descriptions
    2. 1.2 Applications
    3. 1.3 Features
  3. 2HSS-MOTHERBOARDEVM Schematic
  4. 3Connections Descriptions
    1. 3.1 Connectors and Test Points
    2. 3.2 Jumpers
  5. 4HSS-MOTHERBOARDEVM EVM Assembly Drawings and Layout
  6. 5Current Limit
  7. 6Current Sense
  8. 7Transient Protection
  9. 8Soldering Down U2
  10. 9Bill of Materials
  11.   Revision History
  12. IMPORTANT NOTICE
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USER'S GUIDE

High Side Switch Motherboard Evaluation Module

Trademarks

All trademarks are the property of their respective owners.

1 Introduction

Texas Instruments' HSS-MOTHERBOARDEVM evaluation module has a central socket for the supporting daughtercard with the high side switch device to be populated. The EVM supports the entire single-channel and dual channel low Ron (≤ 50-mΩ) high-side driver applications. The purpose of this EVM is to facilitate evaluation of the low Ron high side switches for the diagnostic features and drive resistive, capacitive, and inductive loads.

The EVM is a combination of a central motherboard and a row of daughterboards. The mother board has all connectors, jumpers, and test points. The daughter board has different footprints to support the low Ron family of TI's high side switch portfolio. The daughter board also has limiting resistors for the channel devices (TPS2HBxx-Q1) and since the 1 channel device (TPS1HA08-Q1) has a NC pin in that location the daughtercards will work for all of the devices.

The daughterboards have 2 different footprints: 24-pin PWP and 16-pin PWP. For installation, a single board from the panel has to broken, a device soldered down onto the main footprint, and connected to the motherboard.

Note:

Caution must be taken when soldering down the device as the main power pad on the back needs to be soldered correctly as to not affect performance. Please see PowerPAD Thermally Enhanced Package app note for more details about the solder profile and techniques.

The current-limiting resistors are on the bottom side of the daughterboard. They are all 10-kΩ, 0805 package. For the desired current limit value, the resistor can be replaced with different value. Also for the single channel devices the second resistor should be depopulated.

The jumpers are not installed. Refer to Table 3-1 and Table 3-2 for installation.

1.1 Descriptions

The Texas Instruments HSS-MOTHERBOARDEVM helps designers evaluate the operation and performance of the TPS27SA08, TPS1HA08-Q1, TPS2HB08-Q1, TPS2HB16-Q1, TPS2HB35-Q1 and TPS2HB50-Q1 devices.

These devices are fully-protected high-side switches, with an integrated NMOS power FET, and charge pump. Full diagnostics and high-accuracy current sense features enable intelligent control of the load.

The device diagnostic reporting supports load current status and device temperature on an analog sense output pin SNS. The SNS pin sources a current proportional to the selected parameter. By adding a pulldown resistor on the SNS pin, the developed voltage is proportional to the selected parameter as well. The diagnostics can be disabled for multiplexing the sense pin between different devices.

 

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