TPSI31P1-Q1
Functional Safety FIT Rate, FMD, and Pin FMA

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1 Overview

This document contains information for the TPSI31P1-Q1 (SSOP package) to aid in a functional safety system design. Information provided are:

Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
Component failure modes and distribution (FMD) based on the primary function of the device
Pin failure mode analysis (pin FMA)

Figure 1-1 shows the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram

The TPSI31P1-Q1 was developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides functional safety failure in time (FIT) rates for the TPSI31P1-Q1 device based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours)
Total component FIT rate	19
Die FIT rate	3
Package FIT rate	16

The failure rate and mission profile information in Table 2-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission profile: Motor control from table 11 or figure 16
Power dissipation: 250mW
Climate type: World-wide table 8 or figure 13
Package factor (lambda 3): Table 17b or figure 15
Substrate material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	CMOS, BICMOS ASICs analog and mixed = <50V supply	25 FIT	55°C

The reference FIT rate and reference virtual T_J (junction temperature) in Table 2-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.