LM704A0-Q1
Functional Safety FIT Rate, FMD, and Pin FMA
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2 Overview
This document contains information for LM704A0-Q1 (VQFN package) to aid in a functional safety system design. Information provided are:
- Functional safety failure in time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
- Component failure modes and their distribution (FMD) based on the primary function of the device
- Pin failure mode analysis (pin FMA)
Figure 2-1 shows the device functional block diagram for reference.
Figure 2-1 Functional Block Diagram3 Functional Safety Failure In Time (FIT) Rates
This section provides functional safety failure in time (FIT) rates for LM704A0-Q1 based on two different industry-wide used reliability standards:
- Table 3-1 provides FIT rates based on IEC TR 62380 / ISO 26262 part 11
- Table3-2 provides FIT rates based on the Siemens Norm SN 29500-2
| FIT IEC TR 62380 / ISO 26262 | FIT (Failures Per 109 Hours) |
|---|---|
| LM704A0-Q1 | |
| Total component FIT rate | 38 |
| Die FIT rate | 14 |
| Package FIT rate | 24 |
The failure rate and mission profile information in Table 3-1 comes from the reliability data handbook IEC TR 62380 / ISO 26262 part 11:
- Mission profile: Motor control from Table 11
- LM704A0-Q1 power dissipation: 3.0W
- Climate type: World-wide table 8
- Package factor (lambda 3): Table 17b
- Substrate material: FR4
- EOS FIT rate assumed: 0 FIT
| Table | Category | Device | Reference FIT Rate | Reference Virtual TJ |
|---|---|---|---|---|
| 5 | CMOS, BICMOS ASICs Analog and mixed HV > 50V supply | LM704A0-Q1 | 30 FIT | 75°C |
The reference FIT rate and reference virtual TJ (junction temperature) in Table3-2 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.