TIOL112(x) Functional Safety FIT Rate, FMD and Pin FMA

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1 Overview

This document contains information for TIOL112(x) family of devices (TIOL112, TIOL1123 and TIOL1125) to aid in a functional safety system design. Information provided are:

Functional Safety Failure In Time (FIT) rates of the semiconductor component estimated by the application of industry reliability standards
Component failure modes and their distribution (FMD) based on the primary function of the device
Pin failure mode analysis (Pin FMA)

Figure 1-1 and Figure 1-2 show the device functional block diagram for reference.

Figure 1-1 Functional Block Diagram (TIOL112)

Figure 1-2 Functional Block Diagram (TIOL1123, TIOL1125)

The devices were developed using a quality-managed development process, but was not developed in accordance with the IEC 61508 or ISO 26262 standards.

2 Functional Safety Failure In Time (FIT) Rates

This section provides Functional Safety Failure In Time (FIT) rates for TIOL112(x) family based on two different industry-wide used reliability standards:

Table 2-1 provides FIT rates for TIOL1123/TIOL1125 (with LDO) based on IEC TR 62380 / ISO 26262 part 11
Table 2-2 provides FIT rates for TIOL112 (without LDO) based on IEC TR 62380 / ISO 26262 part 11
Table 2-3 provides FIT rates based on the Siemens Norm SN 29500-2

Table 2-1 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 (TIOL1123, TIOL1125)

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) DRC-10 (VSON Package)
Total Component FIT Rate	9
Die FIT Rate	5
Package FIT Rate	4

The failure rate and mission profile information in Table 2-1 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 550 mW
Climate type: World-wide Table 8
Package factor lambda 3 Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-2 Component Failure Rates per IEC TR 62380 / ISO 26262 Part 11 (TIOL112)

FIT IEC TR 62380 / ISO 26262	FIT (Failures Per 10⁹ Hours) DRC-10 (VSON Package)
Total Component FIT Rate	7
Die FIT Rate	3
Package FIT Rate	4

The failure rate and mission profile information in Table 2-2 comes from the Reliability data handbook IEC TR 62380 / ISO 26262 part 11:

Mission Profile: Motor Control from Table 11
Power dissipation: 200 mW
Climate type: World-wide Table 8
Package factor lambda 3 Table 17b
Substrate Material: FR4
EOS FIT rate assumed: 0 FIT

Table 2-3 Component Failure Rates per Siemens Norm SN 29500-2

Table	Category	Reference FIT Rate	Reference Virtual T_J
5	BICMOS, ASIC, Analog & Mixed ≤ 50 V Supply	25 FIT	55°C

The Reference FIT Rate and Reference Virtual T_J (junction temperature) in Table 2-3 come from the Siemens Norm SN 29500-2 tables 1 through 5. Failure rates under operating conditions are calculated from the reference failure rate and virtual junction temperature using conversion information in SN 29500-2 section 4.